Photocurable and thermosetting matte liquid resist composition

• US 5,753,722 A
• Filed: 12/10/1996
• Issued: 05/19/1998
• Est. Priority Date: 12/13/1995
• Status: Expired due to Term

• Current Assignee: Taiyo Ink Mfg. Co., Ltd. (Taiyo Holdings Company Limited)
• Original Assignee: Taiyo Ink Mfg. Co., Ltd. (Taiyo Holdings Company Limited)
• Inventors: Itokawa, Gen, Kurihara, Koji, Kurabayashi, Nariaki
• Primary Examiner(s): Marquis, Melvyn I.
• Application Number:
  US08/762,714
• Time in Patent Office: 525 Days
• Field of Search: 522/83, 522/146, 522/129
• US Class Current: 522/83
• CPC Class Codes: C08G 59/1494 followed by a further chemical treatment thereof
• CPC Class Codes: C08L 2666/22 Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
• CPC Class Codes: C08L 63/10 Epoxy resins modified by unsaturated compounds
• CPC Class Codes: G03F 7/027 Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds G03F7/075 takes precedence
• CPC Class Codes: H05K 3/287 Photosensitive compositions

Abstract

A photocurable and thermosetting matte liquid resist composition developable with an aqueous alkali solution is disclosed. The composition comprises in combination (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photopolymerization initiator, (C) a diluent, (D) an epoxy compound having at least two epoxy groups in the molecular unit thereof, and further (E) a finely pulverized aluminum silicate matting agent in combination with (F) a filler precipitation preventing agent capable of effective thixotropic adjustment in the composition. The composition may further comprise (G) an epoxy resin curing agent. The composition can be advantageously used for the formation of a solder resist on a printed circuit board.

Claims

1. A photocurable and thermosetting matte liquid resist composition developable with an aqueous alkali solution, comprising in combination:

(A) a photocurable and thermosetting mate liquid resist composition with at least two ethylenically unsaturated bonds,

(B) a photo polymerization initiator,

(C) a diluent,

(D) an epoxy compound having at least two epoxy groups, and further

(E) a finely pulverized aluminum silicate matting agent having an average primary particle diameter in the range of 0.05 to 10 μ

m in combination with (F) a filler precipitation preventing agent.

2. The composition according to claim 1, which further comprises (G) an epoxy resin curing agent.

3. The composition according to claim 1, wherein said matting agent (E) is at least one member selected from the group consisting of kaolinite, calcined clay, pyrophyllite, and sericite.

4. The composition according to claim 1, wherein said matting agent (E) is present in an amount of 25 to 250 parts by weight, based on 100 parts by weight of said photosensitive prepolymer (A).

5. The composition according to claim 1, wherein said filler precipitation preventing agent (F) is organophilic bentonite containing montmorillonite as a principal component thereof.

6. The composition according to claim 1, wherein said filler precipitation preventing agent (F) is at least one member selected from the group consisting of fatty acid amide waxes, polyethylene oxide, amine salts of macromolecular polyesters, salts of linear polyaminoamide with macromolecular acid polyesters, amide solutions of polycarboxylic acids, alkylsulfonates, alkyl allylsulfonates, colloidal esters, aluminum stearate, zinc stearate, white carbon, lecitin, ethyl oleate, and organophilic bentonite.

7. The composition according to claim 1, wherein said filler precipitation preventing agent (F) is present in an amount of 0.5 to 20 parts by weight, based on 100 parts by weight of said photosensitive prepolymer (A).

8. The composition according to claim 1, wherein said photosensitive prepolymer (A) is a compound selected from the group consisting of (1) a reaction product obtained by reacting a polyfunctional epoxy compound with an unsaturated monocarboxylic acid to form an esterified product and subsequently reacting the esterified product with a saturated or unsaturated polybasic acid anhydride, (2) a reaction product obtained by reacting (meth)acrylic acid with a copolymer composed of an alkyl (meth)acrylate and a glycidyl (meth)acrylate and subsequently reacting the resultant reaction product with a saturated or unsaturated polybasic acid anhydride, (3) a reaction product obtained by reacting (meth)acrylic acid with a copolymer composed of a hydroxyalkyl (meth)acrylate, an alkyl (meth)acrylate, and a glycidyl (meth)acrylate and subsequently reacting the resultant product with a saturated or unsaturated polybasic acid anhydride, (4) a reaction product obtained by partially reacting a glycidyl (meth)acrylate with a copolymer composed of an alkyl (meth)acrylate and (meth)acrylic acid, (5) a reaction product obtained by causing a saturated or unsaturated polybasic acid anhydride to react with a reaction product of a polyfunctional epoxy compound, an unsaturated monocarboxylic acid, and a compound having at least two hydroxyl groups and one other reactive group other than a hydroxyl group capable of reacting with an epoxy group in the molecular unit thereof, (6) a reaction product obtained by causing a hydroxyalkyl (meth)acrylate to react with a copolymer of an unsaturated polybasic acid anhydride and an aromatic hydrocarbon having a vinyl group, and (7) a reaction product obtained by causing a saturated or unsaturated polybasic acid anhydride and an unsaturated group-containing monoisocyanate to react with a reaction product of a polyfunctional epoxy compound, an unsaturated monocarboxylic acid, and a compound having at least two hydroxyl groups and one other reactive group other than a hydroxyl group capable of reacting with an epoxy group in the molecular unit thereof.

9. The composition according to claim 1, wherein said photopolymerization initiator (B) is at least one compound selected from the group consisting of acetophenones, benzophenones, benzoin and alkyl ethers thereof, ketals, thioxanthones, anthraquinones, organic peroxides, thiol compounds, and organic halogen compounds and present in an amount of 0.2 to 30 parts by weight, based on 100 parts by weight of said photosensitive prepolymer (A).

10. The composition according to claim 1, wherein said diluent (C) is an organic solvent and present in an amount of 30 to 300 parts by weight, based on 100 parts by weight of said photosensitive prepolymer (A).

11. The composition according to claim 1, wherein said diluent (C) is a photopolymerizable monomer and present in an amount of 3 to 50 parts by weight, based on 100 parts by weight of said photosensitive prepolymer (A).

12. The composition according to claim 1, wherein said epoxy compound (D) is an epoxy resin selected from the group consisting of bisphenol S epoxy resins, diglycidyl terephthalate resin, heterocyclic epoxy resins, bixylenol epoxy resins, biphenol epoxy resins, tetraglycidyl xylenoyl ethane resins, bisphenol A epoxy resins, hydrogenated bisphenol A epoxy resins, bisphenol F epoxy resins, brominated bisphenol A epoxy resins, novolak epoxy resins, novolak epoxy resins of bisphenol A, chelate epoxy resins, glyoxal epoxy resins, amino group-containing epoxy resins, rubber-modified epoxy resins, dicyclopentadiene phenolic epoxy resins, silicone-modified epoxy resins, and ε

-caprolactone-modified epoxy resins, or a mixture thereof.

13. The composition according to claim 1, wherein said epoxy compound (D) is present in an amount of 5 to 100 parts by weight, based on 100 parts by weight of said photosensitive prepolymer (A).

14. The composition according to claim 1, which further comprises a coloring pigment.

15. The composition according to claim 1, which further comprises an anti-foaming agent or a leveling agent.

16. The composition according to claim 1, wherein said epoxy compound (D) is a mixture of

(a) an epoxy resin selected from the group consisting of bisphenol S epoxy resins, diglycidyl terephthalate resin, heterocyclic epoxy resins, bixylenol epoxy resins, biphenol epoxy resins, and tetraglycidyl xylenoyl ethane resins with

(b) another epoxy resin selected from the group consisting of bisphenol A epoxy resins, hydrogenated bisphenol A epoxy resins, bisphenol F epoxy resins, brominated bisphenol A epoxy resins, novolak epoxy resins, novolak epoxy resins of bisphenol A, chelate epoxy resins, glyoxal epoxy resins, amino group-containing epoxy resins, rubber-modified epoxy resins, dicyclopentadiene phenolic epoxy resins, silicone-modified epoxy resins, and ε

-caprolactone-modified epoxy resins.

17. The composition according to claim 1, wherein said epoxy compound (D) is a first epoxy resin which exhibits sparing solubility in the diluent (C) to be used or a mixture thereof with a second epoxy resin which is soluble in the diluent (C).