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Millimeter-wave wireless interconnection of electronic components

  • US 5,754,948 A
  • Filed: 12/29/1995
  • Issued: 05/19/1998
  • Est. Priority Date: 12/29/1995
  • Status: Expired due to Fees
First Claim
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1. An apparatus comprising:

  • a housing;

    a plurality of separated electronic components located within the housing; and

    a plurality of millimeter-wave transmit/receive integrated circuit devices having transmission frequencies of at least 35 GHz;

    wherein each of the millimeter-wave transmit/receive integrated circuit devices is coupled to receive data from a corresponding one of the separated electronic components; and

    wherein data from at least one of the plurality of separated electronic components is transmitted to at least one other of the plurality of separated electronic components via the millimeter-wave transmit/receive integrated circuit devices.

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