Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture

• US 5,760,893 A
• Filed: 12/24/1996
• Issued: 06/02/1998
• Est. Priority Date: 12/24/1996
• Status: Expired due to Term

• Current Assignee: Landrex Technologies Company Limited
• Original Assignee: Teradyne Incorporated
• Inventors: Raymond, Douglas W.
• Primary Examiner(s): Pham, Hoa Q.
• Application Number:
  US08/773,666
• Time in Patent Office: 525 Days
• Field of Search: 356/394, 356/375, 356/376, 356/237, 348/87, 348/126, 348/129
• US Class Current: 356/237.1
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: H05K 2203/166 Alignment or registration; Control of registration
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence

Abstract

A manufacturing defect analyzer, for inspecting assembled printed circuit boards, including a light source, an optical receiver, a computer controller, and a memory. A plurality of key-points are specified for each component mounted to a printed circuit board. A data record characterizing each key-point is then stored in memory. Next, the defect analyzer measures the height of selected key-points relative to reference key-points for each component. Finally, the measured heights are compared with limit values, thereby determining whether each component is defectively attached to the printed circuit board. The data records facilitate inspection of printed circuit boards having components that are available in different package types.

Claims

1. A method for inspecting an assembled printed circuit board, using a device for detecting height data on the assembled printed circuit board, the device including a database memory, comprising the steps of:

(a) locating a plurality of points, the plurality of points being associated with a component attached to the printed circuit board;

(b) creating in the database memory a list having a plurality of elements, each element including limit values related to one of a plurality of package types for the component, at least one of the limit values being related to one of the points located in step (a);

(c) detecting height data for at least one of the points located in step (a);

(d) comparing the detected height data with the limit values included in each element in the list, wherein the comparing is performed sequentially starting with an element in a first list position;

(e) when the detected height data compared in step (d) is outside the limit values included in each element in the list, indicating that the associated component is defectively attached to the printed circuit board;

(f) when the detected height data compared in step (d) is within the limit values included in one of the elements in the list, ceasing the comparison and following a comparison priority procedure comprising the step of

(i) reordering the elements in the list, wherein the one of the elements is moved from a current list position to the first list position, and wherein remaining elements retain respective relative positions; and

(g) repeating steps (c) through (f) for corresponding components on subsequent printed circuit boards.

2. In a process for assembling a printed circuit board, a method for inspecting the assembled board, using a device for detecting height data on the assembled board, wherein the assembled board has a plurality of components attached thereto, comprising the steps of:

(a) locating a plurality of groups of points, each group of points being associated with one of the components, each group of points including at least one point located on a top surface of the associated component and at least one point located on a surface of the assembled board and adjacent to the associated component,

wherein the plurality of groups of points is located before the device for detecting height data is used to inspect the board;

(b) storing information related to each located point, the information including an identifier for the located point, an identifier for the associated component, and coordinates indicating a position of the located point relative to the surface of the assembled board;

(c) dividing the surface of the assembled board into a plurality of regions, each region including at least one located point;

(d) detecting height data for the at least one located point in each region, starting with a first region and continuing sequentially with adjacent regions until height data is detected for each located point;

(e) comparing the detected height data with expected height data; and

(f) when the detected height data does not match the expected height data, identifying at least one defectively attached component using the stored information.

3. The method for inspecting as recited in claim 2,

wherein at least one group of points further includes at least one point located on one of a plurality of leads connected to the associated component.

4. The method for inspecting as recited in claim 3,

wherein the at least one group of points further includes at least one point located on a solder joint connecting the lead to the assembled board.

5. The method for inspecting as recited in claim 4,

wherein the at least one group of points further includes at least one point on the surface of the assembled board, adjacent to the associated component, and between a pair of the leads.

6. The method for inspecting as recited in claim 2,

wherein at least one group of points further includes a point on an orientation mark on the associated component.

7. The method for inspecting as recited in claim 2,

wherein the stored information further includes a type for each located point, the type being selected from the group consisting of a measurement point and a local reference point.

8. The method for inspecting as recited in claim 7,

wherein, when the type is selected as being a measurement point, the stored information further includes an identifier for an associated local reference point, a minimum height value relative to the associated local reference point, and a maximum height value relative to the associated local reference point.

9. The method for inspecting as recited in claim 2,

wherein the detecting comprises the substeps of

(i) generating a plurality of beams of light, each beam striking one of the located points, and

(ii) measuring differences in distances traveled by selected pairs of the beams of light.

10. An apparatus for inspecting an assembled printed circuit board, wherein the assembled board has a plurality of components attached thereto, comprising:

(a) means for storing information related to predetermined groups of points, each group of points being associated with one of the components, the stored information including a first identifier for each point, a second identifier for each component associated with each group of points, and coordinates indicating a position of each point relative to a surface of the assembled board;

(b) means for detecting height data for the points in each group;

(c) means for comparing the detected height data with expected height data; and

(d) means for identifying defectively attached components using the stored information when the detected height data does not match the expected height data,

wherein the groups of points is determined before the means for detecting height data is used to inspect the board.

11. The apparatus for inspecting an assembled printed circuit board as recited in claim 10,

wherein the means for detecting includes a laser diode.

12. The apparatus for inspecting an assembled printed circuit board as recited in claim 10,

wherein each group of points includes at least one point on the associated component and at least one point on the assembled board near the associated component.

13. The apparatus for inspecting an assembled printed circuit board as recited in claim 12,

wherein each group of points further includes at least one point on one of a plurality of leads connected to the associated component, and at least one point on a solder joint connecting the one lead to the assembled board.

14. The apparatus for inspecting an assembled printed circuit board as recited in claim 12,

wherein at least one group of points includes a first point on the assembled board and adjacent to the associated component, a second point on one of a plurality of leads connected to the associated component, a third point on a solder joint connecting one of the leads to the assembled board, a fourth point on the assembled board and adjacent to the associated component and between a pair of the leads, a fifth point on the associated component and near an edge of the associated component, and a sixth point on an orientation mark on the associated component.

15. The apparatus for inspecting an assembled printed circuit board as recited in claim 10,

wherein the means for detecting includes a position-sensitive detector.