Chip card capable of both contact and contactless operation including a contact block
First Claim
1. A chip card to be inserted into a connection apparatus comprisinga first integrated circuit formed as a microprocessor;
- a connection contact connected to the first integrated circuit for furnishing a galvanic connection of the first integrated circuit;
a second integrated circuit connected to the first integrated circuit and formed as a contactless coupling device for furnishing a contactless connection of the first integrated circuit to the connection apparatus through contact-free elements;
a contact block surrounding the first integrated circuit and the second integrated circuit for protection against mechanical effects with the contact block structured as a sensor, sensitive to physical interaction, wherein an output signal of the sensor switches the first integrated circuit to a contact or contactless coupling.
1 Assignment
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Accused Products
Abstract
A chip card capable of selectively transmitting and receiving data via contact members or in a contactless manner (i.e., transmission coils). The chip card includes a contact block which represents and additional protection for the embedded integrated circuits and can also be used as a sensitive switching element for electronic purposes. In particular, based on the function as a switching element, the electronics can be switched on and off by the card user for purposes of the remote transmission. In addition, the contact block can be exchanged and thus assures also the contact card functions, in case the contacts are worn out.
152 Citations
23 Claims
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1. A chip card to be inserted into a connection apparatus comprising
a first integrated circuit formed as a microprocessor; -
a connection contact connected to the first integrated circuit for furnishing a galvanic connection of the first integrated circuit; a second integrated circuit connected to the first integrated circuit and formed as a contactless coupling device for furnishing a contactless connection of the first integrated circuit to the connection apparatus through contact-free elements; a contact block surrounding the first integrated circuit and the second integrated circuit for protection against mechanical effects with the contact block structured as a sensor, sensitive to physical interaction, wherein an output signal of the sensor switches the first integrated circuit to a contact or contactless coupling. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. Chip card with a contact block for the selective coupling of a first integrated circuit (μ
- C), formed as a microprocessor, with a connection apparatus through contacts (according to ISO
7816) or contact-free elements (according to ISO
10536), wherein a contact block (10,
8)exhibits a connection contact (2) for a galvanic connection of the first integrated circuit (μ
C) to the connection apparatus,contains a second integrated circuit (CCI), formed as a contactless coupling device, for a contactless connection of the first integrated circuit (μ
C) to the connection apparatus,includes the two integrated circuits (μ
C+CCI) for protection against mechanical effects, andis structured as a sensor, sensitive to physical interaction, wherein an output signal of the sensor switches the first integrated circuit (μ
C) to a contact or contactless coupling. - View Dependent Claims (11, 12, 13, 14, 15)
- C), formed as a microprocessor, with a connection apparatus through contacts (according to ISO
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16. A chip card for a selective coupling of a first integrated circuit (μ
- C), formed as a microprocessor, for a galvanic connection through connection contacts (8) to a card connection apparatus, and of a second integrated circuit (CCI) for a contact-free connection with the card connection apparatus, wherein
the connection contacts (8) are disposed on a contact block (10,
8), wherein the contact block (10,
8) exhibits at its bottom side a recess (12), which recess (12) serves for receiving at least one of the two integrated circuits (μ
C, CCI) for protection against mechanical interactions, and wherein the contact block (10,
8) is placed onto a support foil (4), wherein the support foil (4) exhibits on its bottom side, disposed oppositely to the contact block (10,
8), a conductor path structure (6) made of coil windings (5) or of capacitor plates for a contact-free coupling of the second integrated circuit (CCI) to the card connection apparatus, whereby the connection contacts (8) are formed at a top side of the contact block (10,
8) as galvanically conductive contact faces (8) for the galvanic connection of the contact block (10,
8) to the card connection apparatus, and wherein the contact faces (8) reach from said top side of the contact block (10,
8) up to locations on an oppositely disposed bottom side of the contact block (10,
8), and wherein openings (3,
9) are provided in the support foil (4) at locations, where the connection contacts (2) of the integrated circuits and of the contact faces (8) come to rest on the bottom side of the contact block (10,
8) upon bringing together the support foil (4) and the integrated circuits as well as the contact block (10,
8), wherein said openings (3,
9) are provided for contacting the integrated circuits (μ
C, CCI) over galvanic connections of the conductor path structure (6) through the openings (3,
9) in the support foil (4). - View Dependent Claims (17, 18, 19, 20, 21, 22)
- C), formed as a microprocessor, for a galvanic connection through connection contacts (8) to a card connection apparatus, and of a second integrated circuit (CCI) for a contact-free connection with the card connection apparatus, wherein
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23. Chip card for the selective coupling of a first integrated circuit (μ
- C), formed as a microprocessor, for a galvanic connection through connection contacts (8) with a card connection apparatus, and of a second integrated circuit (CCI) for a contact-free connection with the card connection apparatus, wherein
the connection contacts (8) are disposed on a contact block (10,
8), wherein the contact block (10,
8) exhibits a recess (12) on its bottom side, and wherein the contact block (10,
8) is placed onto a support foil (4), wherein the support foil (4) exhibits on its bottom side, disposed oppositely to the contact block (10,
8), a conductor path structure (6) made of coil windings (5) or of capacitor plates for a contact-free coupling of the second integrated circuit (CCI) to the card connection apparatus, and wherein the contact block (10,
8) is placed separate from the integrated circuits (μ
C, CCI) on the support foil (4), wherein the connection contacts (8) on a top side of the contact block (10,
9) are formed as galvanically conducting contact faces (8) for the galvanic connection of the contact block (10,
8) to the card connection apparatus, and wherein the contact faces (8) reach from said top side of the contact block (10,
8) up to locations on the oppositely disposed bottom side of the contact block (10,
8), and wherein openings (3,
9) are provided in the support foil (4) at those locations, where the connection contacts (2) of the integrated circuits and of the contact faces (8) come to rest on the bottom side of the contact block (10,
8) upon bringing together the support foil (4) and the integrated circuits as well as the contact block (10,
8), wherein said openings (3,
9) are provided for contacting the integrated circuits (μ
C, CCI) over galvanic connections through the openings (3,
9) in the support foil (4).
- C), formed as a microprocessor, for a galvanic connection through connection contacts (8) with a card connection apparatus, and of a second integrated circuit (CCI) for a contact-free connection with the card connection apparatus, wherein
Specification