Method of manufacturing an enclosed transceiver

• US 5,776,278 A
• Filed: 01/09/1997
• Issued: 07/07/1998
• Est. Priority Date: 06/17/1992
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Communications, Inc. (Micron Technology, Inc.)
• Inventors: Tuttle, John R., Tuttle, Mark E., Lake, Rickie C.
• Primary Examiner(s): Simmons, David A.
• Assistant Examiner(s): Rivard, Paul M.
• Application Number:
  US08/781,107
• Time in Patent Office: 544 Days
• Field of Search: 156/64, 156/213, 156/308.4, 29/854, 29/855, 29/856, 364/708, 364/712, 437/235
• US Class Current: 156/213
• CPC Class Codes: G01S 13/758 using a signal generator powered by the interrogation signal
• CPC Class Codes: G01S 13/767 Responders; Transponders teaching or practice apparatus for gun-aiming or gun-laying using reflecting targets or active targets F41G3/26
• CPC Class Codes: G06K 19/0702 the arrangement including a battery
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/073 Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/2402 Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 2224/24225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01Q 1/22 : by structural association with other equipment or articles
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/28 : Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00
• CPC Class Codes: H01Q 9/285 : Planar dipole H01Q9/065 takes precedence; patch antenna H01Q9/0407
• CPC Class Codes: H04L 2101/604 : Address structures or formats
• CPC Class Codes: H04L 2101/622 : Layer-2 addresses, e.g. medium access control [MAC] addresses
• CPC Class Codes: H04L 61/35 : involving non-standard use of addresses for implementing network functionalities, e.g. coding subscription information within the address or functional addressing, i.e. assigning an address to a function
• CPC Class Codes: H04L 61/5038 : for local use, e.g. in LAN or USB networks, or in a controller area network [CAN]
• CPC Class Codes: H04L 61/5046 : Resolving address allocation conflicts; Testing of addresses testing when self-assigning an address H04L61/5092
• CPC Class Codes: H04L 61/5084 : Providing for device mobility network addressing or numbering for mobility support in wireless networks H04W8/26; mobile IP H04W80/04
• CPC Class Codes: H04L 61/5092 : by self-assignment, e.g. picking addresses at random and testing if they are already in use
• CPC Class Codes: Y10T 156/103 : Encasing or enveloping the configured lamina
• CPC Class Codes: Y10T 29/49171 : with encapsulating

Abstract

The present invention teaches a method of manufacturing an enclosed transceiver, such as a radio frequency identification ("RFID") tag. Structurally, in one embodiment, the tag comprises an integrated circuit (IC) chip, and an RF antenna mounted on a thin film substrate powered by a thin film battery. A variety of antenna geometries are compatible with the above tag construction. These include monopole antennas, dipole antennas, dual dipole antennas, a combination of dipole and loop antennas. Further, in another embodiment, the antennas are positioned either within the plane of the thin film battery or superjacent to the thin film battery.

Claims

1. A method of manufacturing a device including a memory for storing data, the method comprising:

providing a housing defined by first and second housing portions;

providing an integrated circuit including a random access memory for storing the data, and supporting the integrated circuit from the first housing portion;

providing a battery in the housing; and

connecting the battery to the integrated circuit using a conductor supported by and movable with the second housing portion.

2. A method in accordance with claim 1 wherein the step of providing a battery comprises the step of providing a thin film battery.

3. A method in accordance with claim 1 wherein the step of providing a housing comprises providing a housing having a thickness of about 0.03 inches.

4. A method in accordance with claim 1 wherein the step of providing an integrated circuit comprises providing an integrated circuit including a microprocessor, and an RF transmitter controlled by the microprocessor.

5. A method in accordance with claim 1 wherein the step of providing an integrated circuit comprises providing an integrated circuit including a microprocessor, a spread spectrum radio frequency transmitter controlled by the microprocessor, a receiver controlled by the microprocessor, and a static random access memory.

6. A method in accordance with claim 1 wherein the step of connecting the battery comprises connecting the battery using conductive adhesive.

7. A method of manufacturing a device including a memory for storing data, the method comprising:

providing a housing defined by first and second housing portions;

employing an integrated circuit including a microprocessor, including a spread spectrum RF transmitter controlled by the microprocessor, including an RF receiver controlled by the microprocessor, and including a static random access memory for storing the data, and supporting the integrated circuit from the first housing portion;

providing a thin film battery in the housing; and

connecting the battery to the integrated circuit, using a conductor supported by and movable with the second housing portion, with the integrated circuit being powered by the battery, wherein movement of the second housing portion away from the first housing portion results in loss of connection between the battery and the integrated circuit which results in the random access memory losing data.

8. A method in accordance with claim 7 wherein the step of providing a housing comprises providing a housing having a thickness of about 0.03 inches.

9. A method in accordance with claim 7 wherein the step of connecting the battery comprises connecting the battery using conductive epoxy.