Semiconductor package and method thereof

  • US 5,776,798 A
  • Filed: 09/04/1996
  • Issued: 07/07/1998
  • Est. Priority Date: 09/04/1996
  • Status: Expired due to Term
First Claim
Patent Images

1. A method of forming a semiconductor package comprising:

  • forming a substrate having a plurality of package sites and an electronic component attached to the plurality of package sites;

    encapsulating the plurality of package sites wherein the encapsulating forms a continuous encapsulating material covering the plurality of package sites; and

    singulating through the encapsulating material to singulate each package site into an individual package.

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