Wafer spin dryer and method of drying a wafer

• US 5,778,554 A
• Filed: 07/15/1996
• Issued: 07/14/1998
• Est. Priority Date: 07/15/1996
• Status: Expired due to Term

• Current Assignee: Lam Research Corporation
• Original Assignee: Oliver Design Inc. (Seagate Technology Holdings Plc)
• Inventors: Jones, Oliver David
• Primary Examiner(s): Bennett, Henry A.
• Assistant Examiner(s): GRAVINI, STEPHEN MICHAEL
• Application Number:
  US08/680,739
• Time in Patent Office: 729 Days
• Field of Search: 34/314, 34/317, 34/328, 34/58, 134/1, 134/61, 134/902, 15/DIG. 7
• US Class Current: 34/58
• CPC Class Codes: H01L 21/67034 for drying
• CPC Class Codes: Y10S 134/902 Semiconductor wafer

Abstract

In a spin dryer for semiconductor wafers, the wafer is held beneath a platen with its active side (i.e., the side containing the components or circuitry) facing upward. One or more nozzles spray rinse water on the top surface of the wafer and the wafer is rotated to remove the excess rinse water, thereby drying the wafer. A splash guard adjacent the edge of the wafer insures that the excess rinse water thrown off by the spinning wafer is deflected downward where it cannot again come into contact with the active side of the wafer. The platen is rotated dry at the same time, with no rinse water being splashed back onto the active side of the wafer. The spin dryer also includes a separate section which cleans and dries the end-effector of the robot which inserts the wafer into the spin dryer while the wafer is being dried.

Claims

1. A spin dryer comprising:

a rotational member positioned in a drying chamber of said spin dryer, said rotational member being attached to a rotatable shaft;

a spin motor for rotating said shaft;

a plurality of gripping members extending downward from said rotational member, said gripping members being adapted so as to hold a flat substrate below said rotational member; and

at least one nozzle mounted in said spin dryer, said nozzle being positioned so as to direct a spray of liquid onto a top surface of a substrate held by said gripping members.

2. The spin dryer of claim 1 further comprising a semiconductor wafer, said semiconductor wafer being held by said gripping members such that an active side of said semiconductor wafer faces upward.

3. The spin dryer of claim 1 further comprising at least one nozzle positioned so as to direct a spray of liquid onto a bottom surface of a substrate held by said gripping members.

4. The spin dryer of claim 1 wherein said plurality of gripping members comprises three fingers, each of said fingers having a surface contoured for gripping an edge of said substrate.

5. The spin dryer of claim 4 wherein one of said fingers is movable with respect to said rotational member.

6. The spin dryer of claim 5 further comprising a mechanism for moving said one finger from a first position, wherein a substrate can be inserted between said fingers, and a second position, wherein a substrate is held by said three fingers.

7. The spin dryer of claim 6 further wherein said mechanism comprises a spring mechanism, said spring mechanism urging said movable finger toward said second position.

8. The spin dryer of claim 7 further comprising a mechanism for overcoming a force of said spring mechanism so as to move said one finger to said first position.

9. The spin dryer of claim 8 wherein said mechanism for overcoming a force of said spring mechanism comprises a pneumatic cylinder.

10. The spin dryer of claim 5 wherein said movable finger is pivotable about a horizontal axis.

11. The spin dryer of claim 5 wherein two of said fingers are fixed with respect to said rotational member.

12. The spin dryer of claim 1 further comprising a splash guard located near an edge of said substrate, said splash guard comprising a surface for directing droplets thrown laterally from an edge of said substrate to a region below said substrate.

13. The spin dryer of claim 1 further comprising a section for cleaning a robot end-effector.

14. The spin dryer of claim 13 wherein said section comprises a cavity for receiving said end-effector and at least one nozzle for directing a flow of liquid against said end-effector.

15. The spin dryer of claim 14 wherein said section further comprises at least one nozzle for directing a flow of gas against said end-effector.

16. A combination comprising the spin dryer of claim 1 and a semiconductor wafer held by said gripping members in a position below said rotational member, an active side of said wafer facing said rotational member.

17. The spin dryer of claim 1 wherein said rotational member comprises a platen.

18. The spin dryer of claim 1 wherein said drying chamber is sealed from an outside environment.

19. A spin dryer comprising:

a rotational member positioned in a drying chamber of said spin dryer, said rotational member being attached to a rotatable shaft;

a spin motor for rotating said shaft; and

a plurality of gripping members extending from said rotational member, said gripping members being adapted so as to hold a circular substrate, at least one of said gripping members being movable with respect to said rotational member and several of said gripping members being fixed with respect to said rotational member;

wherein said gripping members are positioned with respect to said shaft such that a center of said circular substrate is displaced by a predetermined distance from an axis of rotation of said rotational member when said circular substrate is engaged by said gripping members.

20. The spin dryer of claim 19 wherein said center of said circular substrate is displaced from said axis of rotation in a direction generally away from said at least one movable gripping member.

21. The spin dryer of claim 20 comprising three of said gripping members, one of said gripping members being movable with respect to said rotational member and two of said gripping members being fixed with respect to said rotational member.