Vibrating disk type micro-gyroscope

• US 5,783,749 A
• Filed: 07/05/1996
• Issued: 07/21/1998
• Est. Priority Date: 12/07/1995
• Status: Expired due to Term

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Choi, Boo-Yeon, Lee, Jong-Hyun, Park, Kyung-Ho, Yoo, Hyung-Joun
• Primary Examiner(s): CHAPMAN JR, JOHN E
• Application Number:
  US08/675,970
• Time in Patent Office: 746 Days
• Field of Search: 73/504.01, 73/504.12, 73/504.13, 73/504.02
• US Class Current: 73/504.12
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: G01P 15/0802 Details

Abstract

A vibrating disk type micro-gyroscope and a method of manufacture thereof are disclosed. The micro-gyroscope includes a support platform for supporting a vibrating disk, the vibrating disk converting a resonance frequency into two beat frequencies, a bottom detection electrode for detecting the angular velocity of the gyroscope from a detection of the electrostatic capacitance changes between the bottom detection electrode and the vibrating disk, and an upper drive electrode for exciting the vibrating disk. The method includes the steps of: depositing an insulator layer, a polycrystalline silicon layer, the bottom detection layer, and the bottom sacrificial layer; dry etching the bottom sacrificial layer; depositing polycrystalline silicon doped with dopants; dry etching every area except the support platform and the vibrating disk; depositing an oxide upper sacrificial layer; and forming a pattern and then wet etching the upper sacrificial layer and the bottom sacrificial layer.

Claims

1. A vibrating disk type micro-gyroscope comprising:

a support platform formed on a silicon wafer;

a vibrating disk supported at a center thereof by the support platform to provide a set spacing from the silicon wafer, for converting a resonance frequency into two beat frequencies when vibration of the disk is produced by an electrostatic force;

a circle shaped bottom detection electrode coaxial with the vibrating disk divided into at least four pairs of parts on the silicon wafer, for detecting an angular velocity of the vibrating disk detected from an electrostatic capacitance change between the bottom electrode and the vibrating disk; and

an upper drive electrode, having one end divided into at least two pairs of parts formed on the silicon wafer at a set spacing from the bottom detection electrode and the vibrating disk in a radial direction and extending and bending at a middle thereof and another end formed above the vibrating disk in an axial direction, for driving the vibrating disk.

2. A micro-gyroscope in accordance with claim 1, further comprising:

a sealing structure, placed over the micro-gyroscope at a set spacing from a top of the upper drive electrode, for providing a vacuum sealing of the micro-gyroscope.

3. A micro-gyroscope in accordance with claim 1, wherein:

the bottom detection electrode has twice as many pairs of parts in a shape of a divided circle as a number of pairs of parts of the upper drive electrode.

4. A micro-gyroscope in accordance with claim 1, wherein:

the vibrating disk, the upper drive electrode, and the bottom detection electrode are made of polycrystalline silicon doped with either a p-type or a n-type dopant.

5. A micro-gyroscope comprising:

a circle shaped bottom detection electrode, formed on a silicon wafer and divided into at least four pairs of parts, for detecting an angular velocity of the micro-gyroscope by detection of electrostatic capacitance changes;

a ring-shaped support platform having a set spacing from a circumference of the bottom detection electrode and coaxial with an axis of the bottom detection electrode, and formed on the silicon wafer;

a vibrating disk having a set spacing from the silicon wafer and the bottom detection electrode, having an outer circumference formed on the support platform which is supported by the support platform, for converting a resonance frequency into two beat frequencies in a presence of an excitation by an electrostatic force; and

a circle shaped upper drive electrode coaxial with an axis of the vibrating disk, having a set spacing from the bottom detection electrode and the vibrating disk in the radial direction, having one end formed on the silicon wafer divided into at least two pairs of parts with each part being supported by the silicon wafer, extending upward and bending at a middle thereof toward the axis of the vibrating disk, and another end formed above the vibrating disk having a set spacing from the vibrating disk in an axial direction, for driving the vibrating disk.