Apparatus and method for solder reflow bottom cooling

  • US 5,785,233 A
  • Filed: 02/01/1996
  • Issued: 07/28/1998
  • Est. Priority Date: 02/01/1996
  • Status: Expired due to Term
First Claim
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1. A solder reflow furnace comprising:

  • a transport element disposed within the solder reflow furnace;

    a heating assembly disposed within the solder reflow furnace above said transport element, said heating assembly dispensing hot gas;

    a cooling assembly disposed within said solder reflow furnace below said transport element, said cooling assembly dispensing cold gas; and

    whereby a product having a first side and a second side is brought on said transport element into heat transfer proximity with the hot gas provided by the heating assembly and the cold gas provided by said cooling assembly such that solder on the second side of the product melts and solder on the first side of the product remains solid.

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