Method for forming high dielectric capacitor electrode structure and semiconductor memory devices

• US 5,793,600 A
• Filed: 10/20/1995
• Issued: 08/11/1998
• Est. Priority Date: 05/16/1994
• Status: Expired due to Term

• Current Assignee: Massachusetts Institute of Technology
• Original Assignee: Texas Instruments, Inc.
• Inventors: Numata, Ken, Aoki, Katsuhiro, Fukuda, Yukio, Nishimura, Akitoshi
• Primary Examiner(s): Ledynh, Bot L.
• Application Number:
  US08/545,980
• Time in Patent Office: 1,026 Days
• Field of Search: 365/145, 365/149, 361/311-314, 361/320, 361/321.1, 361/321.2, 361/321.3, 361/321.4, 361/321.5, 361/322, 361/303-305, 257/295, 257/296-300, 257/306-310, 438/393-399, 438/238-239, 438/253, 29/25.42
• US Class Current: 361/321.4
• CPC Class Codes: H01L 28/55 with a dielectric comprising a perovskite structure material
• CPC Class Codes: H01L 28/60 Electrodes
• CPC Class Codes: H01L 28/75 comprising two or more layers, e.g. comprising a barrier layer and a metal layer
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

A capacitor and electrode structure comprising a PZT ferroelectric layer 17 with a primary component (Pb) and secondary component (Ti), a lower electrode layer 16 formed on the underside of the ferroelectric layer and made up of a special element (Pt) and Ti, and compounds thereof, and a diffusion barrier layer 18 which is formed on the underside of the lower electrode layer and which functions as a diffusion barrier with respect to Pb. The capacitor and the electrode structure, which may be a component of a semiconductor memory device, suppress fluctuations in the composition of the ferroelectric layer in PZT, etc., so as to maintain the intended performance of the PZT ferroelectric layer, thereby simplifying and stabilizing film fabrication, and preventing the degradation of electrical characteristics and adverse effects on lower layers.

Claims

1. A method of making a capacitor, comprising the steps of:

providing a substrate having a substrate surface;

forming an electrically interconnecting layer on the substrate surface;

depositing a barrier metal layer on the interconnecting layer to prevent oxidation of the interconnecting layer;

depositing a diffusion barrier layer on the barrier metal;

depositing an oxidation-resistant lower electrode on the diffusion barrier layer, wherein the lower electrode comprises a thermodynamically stable compound;

depositing a dielectric film of high dielectric constant, comprising primary and secondary components, on the lower electrode in an oxygen atmosphere; and

depositing an upper electrode on the dielectric film;

wherein the diffusion barrier layer comprises a material preventing the primary component of the dielectic film from diffusing into the electrically interconnecting layer.

2. The method of claim 1 wherein the dielectric film comprises a ferroelectric material having Pb as the primary component, and the diffusion barrier layer comprises tungsten for preventing Pb from diffusing from the dielectric film to the electrically interconnecting layer.

3. The method of claim 1 wherein the electrically interconnecting layer comprises polysilicon, the dielectric film comprises a ferroelectric material having Pb as the primary component, and the diffusion barrier layer comprises tungsten for preventing Pb from diffusing from the dielectric film to the electrically interconnecting layer.

4. The method of claim 1 wherein the electrically interconnecting layer comprises an n⁺ -type silicon, the dielectric film comprises a ferroelectric material having Pb as the primary component, and the diffusion barrier layer comprises tungsten for preventing Pb from diffusing from the dielectric film to the electrically interconnecting layer.

5. The method of claim 1 wherein the dielectric film comprises a ferroelectric material having Titanium as the secondary component, and the lower electrode comprises a thermodynamically stable compound of Titanium for substantially preventing Titanium from diffusing from the dielectric film to the lower electrode.

6. The method of claim 1, wherein the diffusion barrier layer comprises lutetium or a combination of lutetium and tungsten.

7. The method of claim 1, wherein the diffusion barrier layer comprises ruthenium or compounds of ruthenium.

8. A method of making a semiconductor memory device in an integrated circuit, comprising the steps of:

providing a substrate having a substrate surface;

forming a gate structure with associated source and drain regions on the substrate surface;

forming a word line in contact with the gate structure;

depositing a barrier metal layer over the substrate surface including the gate structure, source region and drain region, such that an electrically conductive contact is made with the drain region, whereby further oxidation of covered substrate surface and the drain region is prevented;

depositing a diffusion barrier layer on the barrier metal;

depositing a lower electrode which comprises a thermodynamically stable compound on the diffusion barrier layer;

depositing an dielectric film of high dielectric constant, comprising primary and secondary components, on the lower electrode in an oxygen atmosphere; and

depositing an upper electrode on the dielectric film; and

wherein the diffusion barrier layer comprises a material preventing the primary component of the dielectic film from diffusing into the substrate surface including the drain region and gate structure.

9. The method of claim 8 wherein the dielectric film comprises a ferroelectric material having Pb as the primary component, and the diffusion barrier layer comprises tungsten for preventing Pb from diffusing from the dielectric film to the substrate surface.

10. The method of claim 8 wherein the drain region comprises an impurity concentration of a first type, the dielectric film comprises a ferroelectric material having Pb as the primary component, and the diffusion barrier layer comprises tungsten for preventing Pb from diffusing from the dielectric film to the drain region.

11. The method of claim 8 wherein the drain region comprises an n+-type silicon, the dielectric film comprises a ferroelectric material having Pb as the primary component, and the diffusion barrier layer comprises tungsten for preventing Pb from diffusing from the dielectric film to the substrate surface.

12. The method of claim 8 wherein the dielectric film comprises a ferroelectric material having Titanium as the secondary component, and the lower electrode comprises a thermodynamically stable compound of Titanium for substantially preventing Titanium from diffusing from the dielectric film to the lower electrode.