Method for producing a semiconductor layer of SiC of the 3C-polytype and a semiconductor device having an insulator between a carrier and the active semiconductor layer
First Claim
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1. A method for producing a semiconductor layer of SiC of the 3C-polytype on top of a semiconductor substrate layer, comprising the steps of:
- 1) growing a buffer layer (1) on a first substrate layer (2) of a first material and a layer (3) of 3C-SiC on top of the buffer layer,2) forming a first amorphous layer (4) on top of the layer of 3C-SiC,3) forming a second amorphous layer (5) of the same material as the first amorphous layer on top of a second substrate layer (6) of a second material,4) placing the upper surfaces of said amorphous layers (4,
5) carried by said two substrate layers (2,
6) face to face and bonding thereof by heating them for forming a single piece,5) removing said first substrate layer (2) and the buffer layer (1) from said piece by etching,6) annealing said piece at such a high temperature that the material of the amorphous layers (4,
5) undergoes viscous flow for relaxing said 3C-SiC-layer (3) for forming a surface layer of a substrate onto which 3C-SiC may be epitaxially grown,7) epitaxially regrowing a second layer (8) of 3C-SiC on top of said relaxed 3C-SiC-layer (3),said steps
1)-7) being carried out in the order mentioned except for the removal of the buffer layer, which may be carried out before step
6) or after step
6) but before step
7).
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Abstract
In a method for producing a semiconductor layer (8) of SiC of the 3C-polytype on top of a semiconductor substrate layer (6) the wafer-bonding technique is utilised. Two amorphous layers are placed face to face and bonded by heating them, and the piece so obtained is annealed at such a high temperature that the material of the amorphous layers is allowed to flow for relaxing a 3C-SiC-layer (4) on top thereof. A second layer (8) of 3C-SiC is after that epitaxially regrown on top of said relaxed 3C-SiC-layer.
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10 Claims
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1. A method for producing a semiconductor layer of SiC of the 3C-polytype on top of a semiconductor substrate layer, comprising the steps of:
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1) growing a buffer layer (1) on a first substrate layer (2) of a first material and a layer (3) of 3C-SiC on top of the buffer layer, 2) forming a first amorphous layer (4) on top of the layer of 3C-SiC, 3) forming a second amorphous layer (5) of the same material as the first amorphous layer on top of a second substrate layer (6) of a second material, 4) placing the upper surfaces of said amorphous layers (4,
5) carried by said two substrate layers (2,
6) face to face and bonding thereof by heating them for forming a single piece,5) removing said first substrate layer (2) and the buffer layer (1) from said piece by etching, 6) annealing said piece at such a high temperature that the material of the amorphous layers (4,
5) undergoes viscous flow for relaxing said 3C-SiC-layer (3) for forming a surface layer of a substrate onto which 3C-SiC may be epitaxially grown,7) epitaxially regrowing a second layer (8) of 3C-SiC on top of said relaxed 3C-SiC-layer (3), said steps
1)-7) being carried out in the order mentioned except for the removal of the buffer layer, which may be carried out before step
6) or after step
6) but before step
7). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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