Surface acoustic wave device

• US 5,818,145 A
• Filed: 04/09/1996
• Issued: 10/06/1998
• Est. Priority Date: 04/10/1995
• Status: Expired due to Fees

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Fukiharu, Eiichi
• Primary Examiner(s): Dougherty, Thomas M.
• Application Number:
  US08/629,433
• Time in Patent Office: 910 Days
• Field of Search: 310/313 R, 310/344, 310/348
• US Class Current: 310/313.00R
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H03H 9/0585 consisting of an adhesive layer
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
• CPC Class Codes: H03H 9/64 using surface acoustic waves

Abstract

A surface acoustic wave device of the present invention includes piezo-electric substrates 1 and 2 each having one surface formed with interdigital electrodes 12A, 12B, for transmission and receiving of surface acoustic waves, are received in a casing including a stem 4, a seal ring 9 and a cover plate 5, etc. The piezo-electric substrates 1 and 2 are arranged such that the one surfaces thereof face each other with a predetermined space therebetween and electrically conductive members 3 are disposed between the piezo-electric substrates 1 and 2. The electrically conductive members 3 may be gold bumps, solder bumps, metal balls of such as solder or copper, electrically conductive adhesive members or electrically conductive rubber members, etc. The surface acoustic wave device is applicable to such as filters and featured by having small mounting area and easiness of manufacture.

Claims

1. A surface acoustic wave device, comprising:

a pair of piezo-electric substrates each having one surface formed with interdigital electrodes and a casing for receiving said piezo-electric substrates, said piezo-electric substrates being arranged with said one surfaces facing each other with a predetermined space therebetween, electrode pads on said piezo-electric substrates, electrically conductive members arranged in said predetermined space between said electrode pads, one of said pair of piezo-electric substrates being smaller and the other being larger in size, said larger piezo-electric substrate having bonding pads disposed on said one surface thereof and at opposite sides of said one surface, and said smaller piezo-electric substrate positioned between said bonding pads at opposite sides of said one surface of said larger piezo-electric substrate.

2. A surface acoustic wave device as claimed in claim 1, wherein said piezo-electric substrates are arranged in said casing so that one is an upper piezo-electric substrate and the other is a lower piezo-electric substrate, and said lower piezo-electric substrate being said larger piezo-electric substrate.

3. A surface acoustic wave device as claimed in claim 1, wherein said electrically conductive members electrically connect electrode pads connected to said interdigital electrodes of one of said piezo-electric substrates to electrode pads of said other piezo-electric substrate.

4. A surface acoustic wave device as claimed in claim 1, wherein said interdigital electrodes formed on said piezo-electric substrates are electrically connected to electrode terminals formed on a surface of said casing.

5. A surface acoustic wave device as claimed in claim 1, wherein said interdigital electrodes formed on said piezo-electric substrates constitute filters.

6. A surface acoustic wave device as claimed in claim 2, wherein said electrically conductive members are metal balls or metal bumps.

7. A surface acoustic wave device as claimed in claim 2, wherein said electrically conductive members are electrically conductive adhesive members or electrically conductive rubber members.

8. A surface acoustic wave device as claimed in claim 2, wherein said electrically conductive members are electrically conductive rubber members, and said casing includes an upper cover plate for receiving said piezo-electric substrates is adapted to press said upper piezo-electric substrate down.