Semiconductor device

  • US 5,821,606 A
  • Filed: 01/29/1997
  • Issued: 10/13/1998
  • Est. Priority Date: 09/20/1988
  • Status: Expired due to Fees
First Claim
Patent Images

1. A semiconductor device comprising:

  • a semiconductor chip having a main surface of a rectangular shape, said semiconductor chip including an integrated circuit and external terminals formed in said main surface, said main surface having a pair of longer edges and a pair of shorter edges, said pair of longer edges extending in a first direction, said pair of shorter edges extending in a second direction substantially perpendicular to said first direction;

    a plurality of leads being disposed over said semiconductor chip and being spaced from one another in said first direction, each of said plurality of leads including a first portion which extends over said main surface, and a second portion which crosses one of said pair of longer edges and extends from said semiconductor chip;

    an insulating film being disposed between said main surface and said first portions of said plurality of leads and adhering said first portions to said main surface, said insulating film extending in said first direction; and

    bonding wires, for electrically connecting said external terminals of said semiconductor chip with said first portions of said plurality of leadswherein said insulating film is divided into at least first and second sub-films such that said at least first and second sub-films are separate from each other in said first direction.

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