Semiconductor device
DCFirst Claim
1. A semiconductor device comprising:
- a semiconductor chip having a main surface of a rectangular shape, said semiconductor chip including an integrated circuit and external terminals formed in said main surface, said main surface having a pair of longer edges and a pair of shorter edges, said pair of longer edges extending in a first direction, said pair of shorter edges extending in a second direction substantially perpendicular to said first direction;
a plurality of leads being disposed over said semiconductor chip and being spaced from one another in said first direction, each of said plurality of leads including a first portion which extends over said main surface, and a second portion which crosses one of said pair of longer edges and extends from said semiconductor chip;
an insulating film being disposed between said main surface and said first portions of said plurality of leads and adhering said first portions to said main surface, said insulating film extending in said first direction; and
bonding wires, for electrically connecting said external terminals of said semiconductor chip with said first portions of said plurality of leadswherein said insulating film is divided into at least first and second sub-films such that said at least first and second sub-films are separate from each other in said first direction.
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Abstract
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
12 Citations
45 Claims
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1. A semiconductor device comprising:
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a semiconductor chip having a main surface of a rectangular shape, said semiconductor chip including an integrated circuit and external terminals formed in said main surface, said main surface having a pair of longer edges and a pair of shorter edges, said pair of longer edges extending in a first direction, said pair of shorter edges extending in a second direction substantially perpendicular to said first direction; a plurality of leads being disposed over said semiconductor chip and being spaced from one another in said first direction, each of said plurality of leads including a first portion which extends over said main surface, and a second portion which crosses one of said pair of longer edges and extends from said semiconductor chip; an insulating film being disposed between said main surface and said first portions of said plurality of leads and adhering said first portions to said main surface, said insulating film extending in said first direction; and bonding wires, for electrically connecting said external terminals of said semiconductor chip with said first portions of said plurality of leads wherein said insulating film is divided into at least first and second sub-films such that said at least first and second sub-films are separate from each other in said first direction. - View Dependent Claims (2, 3, 4, 13, 14, 15, 16, 17, 18, 19, 20, 25, 26, 27, 28)
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5. A semiconductor device comprising:
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a semiconductor chip having a main surface of a rectangular shape, said semiconductor chip including an integrated circuit and external terminals formed in said main surface, said main surface having a pair of longer edges and a pair of shorter edges, said pair of longer edges extending in a first direction, said pair of shorter edges extending in a second direction substantially perpendicular to said first direction; a plurality of leads being disposed over said semiconductor chip and being spaced from one another in said first direction, each of said plurality of leads including a first portion which extends over said main surface, and a second portion which crosses one of said pair of longer edges and extends from said semiconductor chip, said plurality of leads comprising a first group and a second group, separate from each other in said first direction; a first insulating film being disposed between said main surface and said first portions of said first group of said plurality of leads, and adhering said first portions of said first group to said main surface, a second insulating film being disposed between said main surface and said first portions of said second group of said plurality of leads, and adhering said first portions of said second group to said main surface, said first and second insulating films extending in said first direction; and bonding wires for electrically connecting said external terminals of said semiconductor chip with said first portions of said plurality of leads wherein said first and second insulating films are separate from each other in said first direction, at a boundary between said first and second groups of said plurality of leads. - View Dependent Claims (6, 7, 8, 29, 30)
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9. A semiconductor device comprising:
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a semiconductor chip having a main surface of a rectangular shape, said semiconductor chip including an integrated circuit and external terminals formed in said main surface, said main surface having a pair of longer edges and a pair of shorter edges, said pair of longer edges extending in a first direction, said pair of shorter edges extending in a second direction substantially perpendicular to said first direction; a plurality of signal leads being disposed over said semiconductor chip and being spaced from one another in said first direction, each of said plurality of signal leads including a first portion which extends over said main surface, and a second portion which crosses one of said pair of longer edges and extends from said semiconductor chip; a chip supporting lead being disposed over said semiconductor chip, said chip supporting lead including a first portion which extends over said main surface, and a second portion which crosses one of said pair of shorter edges and extends from said semiconductor chip; a first insulating film being disposed between said main surface and said first portions of said plurality of signal leads, and adhering said first portions of said plurality of signal leads to said main surface, said first insulating film extending in said first direction; a second insulating film being disposed between said main surface and said first portion of said chip supporting lead, and adhering said first portion of said chip supporting lead to said main surface, said second insulating film extending in said second direction; and bonding wires for electrically connecting said external terminals of said semiconductor chip with said first portions of said plurality of signal leads. - View Dependent Claims (10, 11, 12, 21, 22, 23, 24, 31, 32)
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33. A semiconductor device comprising:
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a semiconductor chip having a main surface of a quadrilateral shape, said semiconductor chip including semiconductor elements and external terminals formed in said main surface, said main surface having a pair of first edges and a pair of second edges, said pair of first edges extending in a first direction, said pair of second edges extending in a second direction substantially perpendicular to said first direction; an alpha ray shielding film overlying said main surface, said external terminals being exposed through said alpha ray shielding film; a plurality of leads being disposed over said semiconductor chip and being spaced from one another in said first direction, each of said plurality of leads including a first portion which extends over said main surface, and a second portion which crosses one of said pair of first edges and extends from said semiconductor chip; an insulating film being disposed between said alpha ray shielding film and said first portions of said plurality of leads and adhering said first portions to said main surface via said alpha ray shielding film, said insulating film extending in said first direction; and bonding wires, for electrically connecting said external terminals of said semiconductor chip with said first portions of said plurality of leads. - View Dependent Claims (34, 35, 36, 37)
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38. A semiconductor device comprising:
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a semiconductor chip having a main surface of a quadrilateral shape, said semiconductor chip including semiconductor elements and external terminals formed in said main surface, said main surface having a pair of first edges and a pair of second edges, said pair of first edges extending in a first direction, said pair of second edges extending in a second direction substantially perpendicular to said first direction, said external terminals being arranged in said first direction; a plurality of leads disposed over said semiconductor chip at both sides of said external terminals and being spaced from one another in said first direction, each of said plurality of leads including a first portion which extends over said main surface, and a second portion which crosses said pair of first edges and extends from said semiconductor chip; a plurality of first insulating films being disposed between said main surface and said first portions of said plurality of leads at one side of said external terminals and adhering said first portions at one side of said external terminals to said main surface; a plurality of second insulating films being disposed between said main surface and said first portions of said plurality of leads at the other side of said external terminals and adhering said first portions at the other side of said external terminals to said main surface; and bonding wires for electrically connecting said external terminals of said semiconductor chip with said first portions of said plurality of leads. - View Dependent Claims (39, 40, 41, 42)
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43. A semiconductor device comprising:
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a semiconductor chip having a main surface of a quadrilateral shape, said semiconductor chip including semiconductor elements and external terminals formed in said main surface, said main surface having a pair of first edges and a pair of second edges, said pair of first edges extending in a first direction, said pair of second edges extending in a second direction substantially perpendicular to said first direction, said external terminals being arranged in said first direction; first leads disposed over said semiconductor chip at one side of said external terminals and being spaced from one another in said first direction, each of said first leads including a first portion which extends over said main surface, and a second portion which crosses one of said pair of first edges and extends from said semiconductor chip; second leads disposed over said semiconductor chip at the other side of said external terminals and being spaced from one another in said first direction, each of said second leads including a first portion which extends over said main surface, and a second portion which crosses the other of said pair of first edges and extends from said semiconductor chip; a third lead disposed over said semiconductor chip; a first insulating film disposed between said main surface and said first portions of said first leads and arranged between said external terminals and one of said pair of first edges, and adhering said first portions of said first leads to said main surface; a second insulating film disposed between said main surface and said first portions of said second leads and arranged between said external terminals and the other of said pair of first edges, and adhering said first portions of said second leads to said main surface; a third insulating film disposed between said main surface and a portion of said third lead and being arranged between said external terminals and one of said pair of second edges, and adhering said portion of said third lead to said main surface; and bonding wires for electrically connecting said external terminals of said semiconductor chip with said portions of said first to third leads, wherein said first to third insulating films are separated from one another. - View Dependent Claims (44, 45)
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Specification