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Air-conditioning and ventilation simulator in subsurface space

  • US 5,822,227 A
  • Filed: 12/20/1996
  • Issued: 10/13/1998
  • Est. Priority Date: 05/23/1996
  • Status: Expired due to Fees
First Claim
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1. An air-conditioning and ventilation simulator for predicting environmental conditions in a subsurface space, comprising:

  • a first processing portion for obtaining the airflow velocity in branches including a tunnel, stairs, passages, vents, etc. constituting the subsurface space by using, as input data, subsurface space structure model data concerning said branches and movement data of a moving body which makes air move in said subsurface space;

    a second processing portion for calculating initial values and short-term change values of wall temperature and field temperature in each of said branches, initial values and boundary values of temperature, water-vapor density and carbon dioxide concentration in each of said branches, by using, as input data, said space structure model data, analysis result data obtained from said first processing portion, data concerning thermal characteristic of said moving body, data of outside-air temperature, outside-air humidity and outside-air carbon dioxide concentration, and data of passengers which go in and out of said space;

    a third processing portion for calculating wall temperature, field temperature and airflow temperature in each of said branches, by using, as input data, said space structure model data, airflow analysis result data obtained from said first processing portion and thermal analysis result data obtained from said second processing portion; and

    a fourth processing portion for performing detailed calculation of airflow velocity, temperature, humidity and carbon dioxide concentration for calculating time-varying data of airflow temperature, water-vapor density and carbon dioxide concentration in each of said branches by using, as input data, said space structure model data, said airflow analysis result data obtained from said first processing portion, said thermal analysis result data obtained from said second processing portion, and wall and field temperature data obtained from said third processing portion.

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