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In-situ laser patterning of thin film layers during sequential depositing

  • US 5,824,374 A
  • Filed: 07/22/1996
  • Issued: 10/20/1998
  • Est. Priority Date: 07/22/1996
  • Status: Expired due to Fees
First Claim
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1. A method for patterning a plurality of different and sequentially applied coating materials to form a coated substrate, the method comprising steps of:

  • (a) providing a first substrate having a first substrate surface to be coated;

    (b) applying a first coating material to substantially all of the first substrate surface;

    (c) removing one or more regions of the first coating material to a first controlled depth by laser ablation to form a first patterned surface having regions coated with said first coating material and regions without coating;

    (d) applying at least a second coating material to substantially all of the first patterned surface; and

    (e) removing one or more regions of the second coating material to a plurality of second controlled depths by laser ablation to form a second patterned surface having a plurality of different regions selected from the group consisting of regions coated with said second coating material overlying said first coating material, regions coated with said first coating material and regions without coating.

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