Semiconductor laser device

• US 5,825,794 A
• Filed: 12/27/1996
• Issued: 10/20/1998
• Est. Priority Date: 12/28/1995
• Status: Expired due to Fees

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Nemoto, Koji, Sakamoto, Naokazu, Ogino, Shinji, Shindo, Yoichi, Kitamura, Shoji
• Primary Examiner(s): Davie, James W.
• Application Number:
  US08/779,170
• Time in Patent Office: 662 Days
• Field of Search: 372/36, 257/99, 257/100
• US Class Current: 372/36
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01S 5/02234 Resin-filled housings; the housings being made of resin
• CPC Class Codes: H01S 5/0231 Stems
• CPC Class Codes: H01S 5/0232 Lead-frames

Abstract

A semiconductor laser device is provided which includes: a metallic main plate to which a laser diode chip is fixed through a sub-mount incorporating a photo diode and which serves as an electric common for these diodes; three metallic posts that are electrically connected by wires to the main plate, laser diode chip and photo diode, respectively, and are spaced apart from the main plate; and a resin case in which the laser diode chip and sub-mount are sealed and to which fixing end portions of the main plate are fixed. The resin case secures the main plate and the three posts in position such a way as to avoid direct contact therebetween.

Claims

1. A semiconductor laser device comprising:

a laser diode chip having two terminals;

a photo diode having two terminals;

a metallic main plate mounting said laser diode chip and said photo diode, said main plate being an electric common electrode plate for a first terminal of said laser diode chip and a first terminal of said photo diode, and having at least a fixing end portion;

first, second and third metallic posts electrically respectively connected to said main plate, a second terminal of said laser diode chip and a second terminal of said photo diode, respectively, wherein said first, second and third posts being spaced apart from said main plate; and

a resin case in which said laser diode chip and said photo diode and the space between said main plate and said posts are sealed.

2. A semiconductor laser device according to claim 1, further comprising a sub-mount incorporating said photo diode, which is disposed between said laser diode chip and said main plate.

3. A semiconductor laser device according to claim 1, wherein said posts electrically connected by wires to said main plate.

4. A semiconductor laser device according to claim 1, wherein said at least an end portion of said post, which portion protrudes from said resin case, has a center axis that is aligned with an optical axis of a laser beam emitted by said laser diode chip.

5. A semiconductor laser device according to claim 1, wherein said fixing end portion of said main plate and the opposite end portion of said posts to the end electrically connected to said main plate protrude from said resin case.