Interconnection structures and method of making same

  • US 5,830,563 A
  • Filed: 11/20/1996
  • Issued: 11/03/1998
  • Est. Priority Date: 11/29/1995
  • Status: Expired due to Term
First Claim
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1. An interconnection structure comprising one or more insulating films and one or more layers of conductor electrode patterns, wherein at least one of said one or more insulating films comprises a first insulating film which comprises a fluorene skeleton-containing epoxy acrylate resin represented by the following general formula (I):

  • ##STR2## where R is a hydrogen atom or a lower alkyl group, and n is 0 or an integer of 1 to 20.

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