Interconnection structures and method of making same

• US 5,830,563 A
• Filed: 11/20/1996
• Issued: 11/03/1998
• Est. Priority Date: 11/29/1995
• Status: Expired due to Term

• Current Assignee: NEC Corporation
• Original Assignee: NEC Corporation
• Inventors: Matsui, Koji, Utsumi, Kazuaki, Shimoto, Tadanori, Shimada, Yuzo, Funada, Yoshitsugu
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US08/752,798
• Time in Patent Office: 713 Days
• Field of Search: 428/209, 428/901, 428/421
• US Class Current: 428/209
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/0394 Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 3/0023 by exposure and development of a photosensitive insulating layer
• CPC Class Codes: H05K 3/184 using masks
• CPC Class Codes: H05K 3/465 by applying an insulating layer having channels for the next circuit layer
• CPC Class Codes: H05K 3/4661 Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor other insulating materials H05K3/387
• CPC Class Codes: H05K 3/4676 Single layer compositions
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/3154 Of fluorinated addition polymer from unsaturated monomers

Abstract

This invention relates to an interconnection structure comprising one or more insulating films and one or more layers of conductor electrode patterns, wherein at least one of the insulating films consists of a fluorene skeleton-containing epoxy acrylate resin, and to a method of making a multilayer interconnection structure including the steps of roughening the surface of an insulating resin layer and forming a conductor thereon by electroless plating, wherein the average roughness (Ra), maximum roughness (Ry) and conductor thickness (T) of the roughened surface of the insulating resin layer satisfy the following relations:

0.2≦Ra≦0.6 (unit: μm)                     (1)

0.02≦Ra/T≦0.2                                (2)

0.05≦Ry/T≦0.5                                (3)

and catalyst nuclei for electroless plating are supplied by applying a solution of a metallic salt to the roughened surface of the insulating resin layer or dipping the substrate in a solution of a metallic salt, drying and heat-treating the substrate, and then subjecting it to displacement palladium plating.

Claims

1. An interconnection structure comprising one or more insulating films and one or more layers of conductor electrode patterns, wherein at least one of said one or more insulating films comprises a first insulating film which comprises a fluorene skeleton-containing epoxy acrylate resin represented by the following general formula (I):

##STR2## where R is a hydrogen atom or a lower alkyl group, and n is 0 or an integer of 1 to 20.

2. An interconnection structure as claimed in claim 1 wherein one or more interlayer insulating films and one or more layers of conductor electrode patterns are alternately and successively formed to make a multilayer interconnection structure.

3. An interconnection structure as claimed in claim 1 or 2 wherein said first insulating film is formed on a substrate, and said conductor electrode patterns are formed on said first insulating film.

4. An interconnection structure as claimed in claim 3 wherein said substrate is a printed wiring board or a molded resin wiring board.

5. An interconnection structure as claimed in claim 1 wherein said first insulating film is formed on a substrate having metallic conductor connections or metallic conductor electrode patterns, and wherein said one or more insulating films further comprises a second insulating film comprising benzocyclobutene resin which is formed on said first insulating film.

6. An interconnection structure as claimed in claim 5 wherein said first insulating film is patterned so as to exist only on said metallic conductor connections or metallic conductor electrode patterns.

7. An interconnection structure as claimed in claim 1 wherein said first insulating film comprises surface regions that have a roughened surface.

8. An interconnection structure as claimed in claim 1 wherein said first insulating film comprises surface regions that have an average roughness (Ra), wherein 0.2≦

Ra≦

0.6 (unit;

μ

m).

9. An interconnection structure as claimed in claim 1 wherein said first insulating film has an average thickness of about 0.1 to 1.0 μ

m.