Interconnection structures and method of making same

  • US 5,830,563 A
  • Filed: 11/20/1996
  • Issued: 11/03/1998
  • Est. Priority Date: 11/29/1995
  • Status: Expired due to Term
First Claim
Patent Images

1. An interconnection structure comprising one or more insulating films and one or more layers of conductor electrode patterns, wherein at least one of said one or more insulating films comprises a first insulating film which comprises a fluorene skeleton-containing epoxy acrylate resin represented by the following general formula (I):

  • ##STR2## where R is a hydrogen atom or a lower alkyl group, and n is 0 or an integer of 1 to 20.

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