Lead-free, low-temperature solder compositions
First Claim
Patent Images
1. A lead-free, low-temperature electrical solder composition consisting essentially of:
- 43% Sn;
47% Bi;
5-15% Sb; and
0.1-3% of at least one metal selected from the group consisting of;
Te, Se, Au, Ni, Ce, Cs, Co, Si, Mg, Ca, and a mixture of any of them,the solder having a melting temperature 133°
-167°
C.
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0 Petitions
Accused Products
Abstract
Electrical solder compositions (by weight percent) having between 43-58% Sn; 38-52% Bi; and at least one of: 5-15%Sb; 1-4.0% Cu; 2% In; and 1-2% Ag, and having a melting temperature 133°-167° C. The solders are lead-free and have low melting points making them particularly useful for applications wherein components being joined involve thermoplastic substrates.
44 Citations
1 Claim
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1. A lead-free, low-temperature electrical solder composition consisting essentially of:
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43% Sn; 47% Bi; 5-15% Sb; and 0.1-3% of at least one metal selected from the group consisting of;
Te, Se, Au, Ni, Ce, Cs, Co, Si, Mg, Ca, and a mixture of any of them,the solder having a melting temperature 133°
-167°
C.
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Specification
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Current AssigneeVisteon Global Technologies Incorporated (Visteon Corporation)
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Original AssigneeFord Motor Company
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InventorsShangguan, Dongkai, Paruchuri, Mohan R.
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Primary Examiner(s)Ip, Sikyin
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Application NumberUS08/938,574Time in Patent Office410 DaysField of Search420/557, 420/561, 420/562, 420/577, 420/580, 420/589US Class Current420/589CPC Class CodesB23K 35/264 Bi as the principal constit...C22C 30/04 containing tin or lead
