Electronic package carrying an electronic component and assembly of mother board and electronic package

CAFC
  • US 5,838,551 A
  • Filed: 08/01/1996
  • Issued: 11/17/1998
  • Est. Priority Date: 08/01/1996
  • Status: Expired due to Term
First Claim
Patent Images

1. An electronic package comprising:

  • a rigid planar dielectric substrate carrying a ground member extending across substantially the whole area within the confines of the edges of the substrate;

    a covering EMI shield extending over the electronic component to locate the electronic component between the EMI shield and the around member of the substrate, the EMI shield being electrically interconnected to the ground member of the substrate to form with the ground member, a Faraday cage around the electronic component;

    and a plurality of second level interconnects mounted upon a second side of the substrate and electrically interconnected through circuit paths in the substrate to the first level interconnects.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×