Probe apparatus for electrical inspection of printed circuit board assembly

• US 5,850,146 A
• Filed: 07/18/1996
• Issued: 12/15/1998
• Est. Priority Date: 12/30/1995
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Cho, Hyung-suck, Shim, Jae-hong, Kam, Do-young
• Primary Examiner(s): Karlsen, Ernest F.
• Assistant Examiner(s): KOBERT, RUSSELL MARC
• Application Number:
  US08/680,693
• Time in Patent Office: 880 Days
• Field of Search: 324/754, 324/761, 324/72.5, 324/757, 324/758, 324/715
• US Class Current: 324/750.23
• CPC Class Codes: G01R 1/06705 Apparatus for holding or moving single probes for moving multiple probe heads or ICs under test G01R31/2886
• CPC Class Codes: G01R 31/2806 Apparatus therefor, e.g. test stations, drivers, analysers, conveyors G01R31/2805, G01R31/281, G01R31/2818 take precedence

Abstract

A probe apparatus for the electrical inspection of a printed circuit board (PCB) assembly includes a probe assembly for inspecting the electrical circuitry of a PCB having electronic components mounted thereon. A first driving mechanism is provided for moving the probe assembly rectilinearly, and a guide is provided for guiding the rectilinear movement of the probe assembly. The probe assembly includes a probe tip for making contact with a solder joint on the PCB to detect a signal for the electrical inspection, a force sensor combined with the rear portion of the probe tip for measuring a contact force applied to the probe tip when the probe tip makes contact with the solder joint, a location sensor for measuring the location of the probe tip when in contact with the solder joint, and a device for controlling the location of the probe tip, according to the measured contact force and location thereof. The probe may further include a second driving mechanism for controlling the angle of inclination of the probe assembly to solder joints. Such a probe is improved in adaptability to the various patterns of the solder joints and thus enables stable testing of the PCB, by preventing poor soldering as well as vibration of the probe tips.

Claims

1. A probe apparatus for electrical inspection of a printed circuit board (PCB) assembly which includes a printed circuit board having electronic components mounted thereon and defining electrical circuitry, said probe apparatus comprising:

a probe assembly including a probe tip for inspecting the electrical circuitry of the printed circuit board having the electronic components mounted thereon, said probe assembly normally being disposed at an inclined angle position with respect to the printed circuit board;

means for moving said probe assembly rectilinearly toward and away from the printed circuit board along the inclined angle position;

a guide for guiding the rectilinear movement of said probe assembly toward and away from the printed circuit board along the inclined angle position; and

means for controlling the inclined angle position of the probe assembly with respect to a solder joint on the printed circuit board, said inclined angle position controlling means being operative to rotate said probe assembly and in turn said probe tip.

2. The probe apparatus for electrical inspection of a PCB assembly as claimed in claim 1, wherein said probe assembly comprises:

a probe tip for making contact with a solder joint of a corresponding one of the electronic components mounted on the printed circuit board to detect a signal for the electrical inspection, said probe tip defining a rear portion;

a force sensor, combined with the rear portion of the probe tip, for measuring a contact force applied to said probe tip when said probe tip makes contact with the solder joint;

a location sensor for measuring a location of said probe tip when in contact with the solder joint; and

,

means for controlling the location of said probe tip, according to the measured contact force and location thereof.

3. The probe apparatus for electrical inspection of a PCB assembly as claimed in claim 2, wherein the location controlling means comprises:

a light source fixed at a predetermined location for emitting a laser beam along a path;

a moving mirror movably installed along the path of the laser beam for reflecting the laser beam to said location sensor; and

a moving coil for moving said moving mirror along the path of the laser beam by moving according to an electric current controllably applied in response to the measured contact force and location of the probe tip.

4. The probe apparatus for electrical inspection of a PCB assembly as claimed in claim 3, wherein said location controlling means further comprises:

a body inside of which said moving mirror and moving coil are installed; and

a fixed mirror installed on the path of the laser beam between said light source and said moving mirror for reflecting the laser beam to said moving mirror,

wherein said location sensor is located near said body, said body being formed with a hole to transmit the laser beam reflected from the moving mirror to the location sensor.

5. A probe apparatus for electrical inspection of a printed circuit board (PCB) assembly which includes a printed circuit board having electronic components mounted thereon and defining electrical circuitry, said probe apparatus comprising:

a probe assembly including a probe tip for inspecting the electrical circuitry of the printed circuit board having the electronic components mounted thereon, said probe assembly normally being disposed at an inclined angle position with respect to the printed circuit board;

a first driving mechanism which moves said probe assembly rectilinearly toward and away from the printed circuit board along the inclined angle position;

a guide for guiding the rectilinear movement of said probe assembly toward and away from the printed circuit board along the inclined angle position; and

a second driving mechanism which controls the inclined angle position of the probe assembly with respect to a solder joint on the printed circuit board, said second driving mechanism being operative to rotate said probe assembly and in turn said probe tip.

6. The probe apparatus for electrical inspection of a PCB assembly as claimed in claim 5, wherein said probe assembly includes a probe block, and wherein said first driving mechanism includes a first driving motor and a rotational-to-rectilinear motion conversion mechanism disposed between said first driving motor and said probe block, thereby to convert rotation of the first driving motor into the rectilinear movement of said probe assembly toward and away from the printed circuit board.

7. The probe apparatus for electrical inspection of a PCB assembly as claimed in claim 6, wherein said second driving mechanism includes a motor block combined with said probe block, and a second driving motor having a drive shaft, said motor block being combined with said drive shaft, thereby to rotate said probe assembly and thus control the inclined angle position of said probe assembly.