Prepreg, process for producing the same and printed circuit substrate/board using the same
First Claim
1. A prepreg comprising a porous para-oriented aromatic polyamide film impregnated with a thermoplastic resin and/or a thermosetting resin, wherein the porous para-oriented aromatic polyamide film is composed of para-aramid fibrils having a diameter of not more than 1 μ
- m, with the fibrils planarly arranged as a network or a nonwoven fabric and laminated in layer form, and the film has a linear thermal expansion coefficient at 200°
to 300°
C. of ±
50×
10-6 /°
C. and has 30 to 95% of vacant spaces.
1 Assignment
0 Petitions
Accused Products
Abstract
The present invention provides a lightweight prepreg having uniform formation, low linear thermal expansion coefficient and good mechanical strength, comprising a porous para-oriented aromatic polyamide film and a thermoplastic resin and/or a thermosetting resin, the porous para-oriented aromatic polyamide film being impregnated with the thermoplastic resin and/or the thermosetting resin, a process for producing the same, and a printed circuit substrate/board using the same.
51 Citations
5 Claims
-
1. A prepreg comprising a porous para-oriented aromatic polyamide film impregnated with a thermoplastic resin and/or a thermosetting resin, wherein the porous para-oriented aromatic polyamide film is composed of para-aramid fibrils having a diameter of not more than 1 μ
- m, with the fibrils planarly arranged as a network or a nonwoven fabric and laminated in layer form, and the film has a linear thermal expansion coefficient at 200°
to 300°
C. of ±
50×
10-6 /°
C. and has 30 to 95% of vacant spaces. - View Dependent Claims (2, 3, 4, 5)
- m, with the fibrils planarly arranged as a network or a nonwoven fabric and laminated in layer form, and the film has a linear thermal expansion coefficient at 200°
Specification