Implantable medical device microstrip telemetry antenna

• US 5,861,019 A
• Filed: 07/25/1997
• Issued: 01/19/1999
• Est. Priority Date: 07/25/1997
• Status: Expired due to Term

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Sun, Weimin, Haubrich, Gregory J., Dublin, Garry L.
• Primary Examiner(s): Kamm, William E.
• Assistant Examiner(s): SCHAETZLE, KENNEDY
• Application Number:
  US08/900,624
• Time in Patent Office: 543 Days
• Field of Search: 607/60, 607/30, 607/32, 607/36
• US Class Current: 607/60
• CPC Class Codes: A61N 1/37229 Shape or location of the implanted or external antenna
• CPC Class Codes: H01Q 1/273 Adaptation for carrying or wearing by persons or animals
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 1/405 Radome integrated radiating elements
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

A microstrip RF telemetry antenna is formed on or within the exterior surface of an implantable medical device housing that is formed either of a conductive metal or of a non-conductive dielectric material. The microstrip antenna is formed of an electrically conductive radiator patch layer that is laminated upon an exterior facing side of a dielectric substrate layer of relatively constant thickness. A conductive ground plane layer is formed on the opposite side of the dielectric substrate layer to extend parallel to and at least coextensively with the radiator patch layer. The radiator patch layer is coupled to the transceiver circuitry within the implantable medical device housing by a feedthrough extending through the dielectric substrate layer, the ground plane layer and the implantable medical device housing side wall. If the implantable medical device housing is conductive it may form the ground plane layer over which the dielectric substrate layer and the radiator patch layer are formed through deposition or other techniques. If the implantable medical device housing is formed of a suitable non-conductive dielectric material, the ground plane layer is formed on an interior surface thereof and the radiator patch layer is formed on an exterior housing surface thereof, preferably by deposition techniques. The ground plane layer may be recessed to form a cavity backed ground plane that receives the dielectric layer and radiator patch layer within the cavity. The exterior surfaces of the radiator patch layer, the dielectric layer and any exposed surface of the ground plane layer may be electrically insulated by a radome layer.

Claims

1. A telemetry system for communications between an external programmer and an implantable medical device, comprising:

the external programmer comprising an external telemetry antenna and an external transceiver for receiving uplink telemetry transmissions and transmitting downlink telemetry transmission through the external telemetry antenna;

the implantable medical device comprising an implantable medical device housing, an implantable telemetry antenna and an implantable transceiver for receiving downlink transmissions and for transmitting uplink telemetry transmission through the implantable telemetry antenna, the implantable medical device housing being formed of a conductive metal and having an exterior housing surface and an interior housing surface;

the implantable medical device housing being formed with a housing recess extending inwardly from the exterior housing surface to a predetermined housing recess depth in the predetermined substrate area of the exterior housing surface for receiving the dielectric substrate therein;

wherein the implantable telemetry antenna is a conformal microstrip antenna formed as part of the implantable medical device housing, the microstrip antenna having electrically conductive ground plane and radiator patch layers separated by a dielectric substrate, layer the conductive radiator patch layer having a predetermined thickness and predetermined radiator patch layer dimensions, the patch layer being formed upon one side of the dielectric substrate layer.

3. The telemetry system of claim 1 further comprising a diadem layer of dielectric material formed over the conductive radiator patch layer.

4. The telemetry system of claim 1, wherein

the implantable medical device housing is formed of a non-conductive dielectric substrate layer having an exterior housing surface and an interior housing surface;

the conductive ground plane layer is formed as a conductive metal layer adhering to the interior housing surface; and

the conductive radiator patch layer is formed between the exterior and interior housing surfaces to extend parallel to the ground plane layer and to be separated therefrom by an intermediate dielectric substrate layer of the medical device housing.

5. The telemetry system of any of preceding claims 1, 2 or 4, wherein the transceiver is disposed within the implantable medical device housing and further comprises feedthrough means extending through the conductive ground plane layer and the dielectric substrate layer to the radiator patch layer for electrically connecting the implantable transceiver within the implantable medical device housing with the radiator patch layer.

6. The telemetry system of any of preceding claims 1, 2 or 4 further comprising means for forming a ground plane layer extension in the same plane as, and surrounding the periphery of, the patch radiator layer.

2. A telemetry system for communication between an external programmer and an implantable medical device, wherein:

the external programmer comprises an external telemetry antenna and an external transceiver from receiving uplink telemetry transmissions and transmitting downlink telemetry transmissions through the external telemetry antenna;

the implantable medical device comprises an implantable medical device housing, an implantable telemetry antenna and an implantable transceiver for receiving downlink telemetry transmissions and for transmitting uplink telemetry transmission through the implantable telemetry antenna, the implantable medical device housing being formed of a conductive metal and having an exterior housing surface and an interior housing surface, the implantable medical device housing further being formed with a housing recess extending inwardly from the exterior housing surface to a predetermined housing recess depth in the predetermined substrate area of the exterior housing surface for receiving the dielectric substrate therein,

the implantable medical device housing being formed as a conductive metal layer adhering to the interior housing surface;

the implantable telemetry antenna is a conformal microstrip antenna formed as part of the implantable medical device housing, the microstrip antenna having electrically conductive ground plane and radiator patch layers separated by a dielectric substrate layer the conductive radiator patch layer having a predetermined thickness and predetermined radiator patch layer dimensions, the patch layer being formed upon one side of the dielectric substrate layer;

the conductive ground plane layer is at least a portion of the conductive metal housing and has predetermined ground plane dimensions such that the conductive ground plane layer extends substantially in parallel to and at least coextensively with the conductive radiator patch layer, and

the dielectric substrate is formed over a predetermined substrate area of the exterior housing surface, the dielectric substrate having an exposed exterior substrate surface, and

the conductive radiator patch is formed over at least a portion of the extension substrate surface.

7. An implantable medical device, comprising:

an implantable telemetry antenna;

an implantable medical device housing; and

a transceiver coupled to the implantable telemetry antenna for communications between an external medical device and the implantable medical device,

wherein the implantable telemetry antenna is conformal microstrip antenna formed as part of the implantable medical device housing, the microstrip antenna having electrically conductive ground plane and radiator patch layers separated by a dielectric substrate layer,

the implantable medical device housing is formed of a non-conductive dielectric substrate layer having an exterior housing surface and an interior housing surface;

the conductive ground plane layer is formed as a conductive metal layer adhering to the interior housing surface, and

the conductive radiator patch layer is formed over at least a portion of the exterior housing surface.

8. The telemetry antenna of claim 7, wherein the conductive radiator patch layer has predetermined radiator patch layer dimensions and is formed upon one side of the dielectric substrate layer,

the implantable medical device housing is formed of a conductive metal and has an exterior housing surface and an interior housing surface;

the conductive ground plane layer is at least a portion of the conductive metal housing and has predetermined ground plane dimensions such that the conductive ground plane layer extends substantially in parallel to and at least coextensively with the conductive radiator patch layer;

the dielectric substrate is formed over a predetermined substrate area of the exterior housing surface, the dielectric substrate having an exposed exterior substrate surface;

the conductive radiator patch layer is formed over at least a portion of the exterior substrate surface, and

the implantable medical device housing is formed with a housing recess extending inwardly from the exterior housing surface to a predetermined housing recess depth in the predetermined substrate area of the exterior housing surface for receiving the dielectric substrate therein.

9. The telemetry antenna of any of preceding claims 7 or 8, further comprising a radome layer of dielectric material formed over the conductive radiator patch layer.

10. The telemetry antenna of claim 7, wherein the implantable medical device housing is formed of a non-conductive dielectric substrate layer having an exterior housing surface and an interior housing surface;

the conductive ground plane layer is formed as a conductive metal layer adhering to the interior housing surface; and

the conductive radiator patch layer is formed between the exterior and interior housing surfaces to extend parallel to the ground plane layer and to be separated therefrom by an intermediate dielectric substrate layer of the medical device housing.

11. The telemetry antenna of any of preceding claims 7, 8 or 10, wherein the transceiver is disposed within the implantable medical device housing and further comprises feedthrough means extending through the conductive ground plane layer and the dielectric substrate layer to the radiator patch layer for electrically connecting the implantable transceiver within the implantable medical device housing with the radiator patch layer.

12. The telemetry antenna of any of preceding claims 7, 8 or 10 further comprising the step of forming a ground plane layer extension in the same plane as, and surrounding the periphery of, the patch radiator layer.

13. A method of forming an implantable RF telemetry antenna as part of the housing of an implantable medical device for telemetry between an external medical device and the implantable medical device, comprising the steps of:

forming an implantable medical device housing having exterior housing surface and an interior housing surface for receiving components of the implantable medical device therein;

disposing a transceiver for receiving downlink telemetry transmissions and for transmitting uplink telemetry transmissions through the implantable RF telemetry antenna within the implantable medical device housing; and

forming a conformal microstrip antenna as part of the implantable medical device housing, the microstrip antenna having a conductive ground plane layer and a conductive radiator patch layer separated by a dielectric substrate layer.

14. The method of claim 13, wherein the microstrip antenna forming step further comprises

forming the dielectric substrate layer with a predetermined substrate layer thickness and an interior substrate surface and an exterior substrate surface;

and

forming the electrically conductive radiator patch layer on the exterior substrate surface to have predetermined radiator patch layer dimensions.

15. The method of claim 14, further comprising the step of forming the conductive ground plane layer on the interior substrate surface to have predetermined ground plane dimensions such that the conductive ground plane layer extends substantially in parallel to and at least coextensively with the conductive radiator patch layer.

16. The method of claim 13, wherein

the step of forming an implantable medical device housing further comprises forming the implantable medical device housing of a conductive metal such that the conductive ground plane layer is at least a portion of the conductive metal housing;

and

the step of forming the microstrip antenna further comprises the steps of;

forming the dielectric substrate layer on at least a portion of the exterior housing surface to have a predetermined substrate layer thickness and an interior substrate surface and an exterior substrate surface; and

forming the electrically conductive radiator patch layer on at least a portion of the exterior substrate surface.

17. The method of claim 13, wherein

the step of forming an implantable medical device housing further comprises the steps of:

forming the implantable medical device housing of a conductive metal such that the conductive ground plane layer is at least a portion of the conductive metal housing; and

forming a housing recess extending inwardly from the exterior housing surface to a predetermined housing recess depth in a predetermined substrate area of the exterior housing surface; and

the step of forming the microstrip antenna further comprises the steps of;

forming the dielectric substrate layer within the housing recess to have a relatively constant thickness and interior and exterior substrate surfaces; and

forming the conductive radiator patch layer on at least a portion of the exterior substrate surface.

18. The method of claim 13, wherein

the step of forming an implantable medical device housing comprises forming the implantable medical device housing of a non-conductive dielectric material;

and

the step of forming the microstrip antenna further comprises the steps of;

forming the conductive radiator patch layer on the exterior housing surface to have predetermined radiator patch layer dimensions and an exposed radiator patch layer surface; and

forming the conductive ground plane layer as a conductive metal layer adhering to the interior housing surface, wherein the implantable medical device housing functions as the dielectric substrate layer with a relatively constant thickness.

19. The method of any one of the preceding claims 13-18 further comprising the step of

forming a radome layer of dielectric material over the exposed radiator patch layer surface.

20. The method of claim 13, wherein

the step of forming an implantable medical device housing comprises forming the implantable medical device housing of a non-conductive dielectric material;

and

the step of forming the microstrip antenna further comprises the steps of;

forming the electrically conductive radiator patch layer between the exterior and interior housing surfaces; and

forming the conductive ground plane layer as a conductive metal layer adhering to the interior housing surface such that an intermediate dielectric substrate layer of the implantable medical device housing functions as the dielectric substrate layer.

21. The method of any of the preceding claims 13-18 or 20 further comprising the step of

extending feedthrough means through the conductive ground plane layer and the dielectric substrate layer to electrically connect the transceiver within the implantable medical device housing with the conductive radiator patch layer.

22. The method of any of the preceding claims 13-18 or 20 further comprising the step of forming a ground plane layer extension in the same plane as, and surrounding the periphery of, the patch radiator layer.