Smart-cut process for the production of thin semiconductor material films

• US 5,882,987 A
• Filed: 08/26/1997
• Issued: 03/16/1999
• Est. Priority Date: 08/26/1997
• Status: Expired due to Term

• Current Assignee: Soitec Silicon On Insulator Technologies SA (Soitec S.A.)
• Original Assignee: International Business Machines Corporation
• Inventors: Srikrishnan, Kris V.
• Primary Examiner(s): DANG, TRUNG Q
• Application Number:
  US08/920,117
• Time in Patent Office: 567 Days
• Field of Search: 438/458, 438/455, 438/406, 438/407, 438/528, 438/977, 148/DIG. 12
• US Class Current: 438/458
• CPC Class Codes: H01L 21/76251 using bonding techniques
• CPC Class Codes: H01L 21/76254 with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
• CPC Class Codes: Y10S 148/05 Etch and refill
• CPC Class Codes: Y10S 438/977 Thinning or removal of substrate

Abstract

A process applicable to the production of monocrystalline films improves on the Smart-Cut® process by using an etch stop layer in conjunction with the Smart-Cut® process. Because of the etch stop layer, no chemical-mechanical polishing (CMP) is required after fabrication. Thus, the thickness and smoothness of the device layer in the fabricated silicon on insulator (SOI) substrate is determined by the uniformity and smoothness of the deposited layers and wet etch selectivity, as opposed to the CMP parameters. Therefore, the smoothness and uniformity of the device layer are improved.

Claims

1. A method of forming a thin semiconductor layer of substantially uniform thickness upon which semiconductor structures can be subsequently formed, comprising the steps of:

providing a first wafer comprising a semiconductor substrate;

forming an etch stop layer having a thickness upon said first wafer;

forming a device layer having a thickness on said etch stop layer;

.

forming a bonding layer on said device layer;

implanting ions into said semiconductor substrate to form a buried layer therein;

bonding said bonding layer to a second wafer;

heating said bonded first and second wafers to a first temperature;

separating said bonded first and second wafers along said buried layer so that said second wafer has a top surface layer; and

removing said top surface layer and said etch stop layer,

whereby underlying portions of said device layer remain on said second wafer to form the thin semiconductor layer.

2. The method according to claim 1, further comprising the step of heating said second wafer having said top surface layer to a second temperature after said step of separating.

3. The method of claim 2, wherein said step of heating the second wafer includes annealing at about 1000°

C. for a time in the range between about 30 minutes and about 8 hours.

4. The method according to claim 1, wherein said semiconductor substrate is a silicon (Si) substrate and said ions comprise hydrogen ions, such that said buried layer is comprised of hydrogen and silicon.

5. The method according to claim 4, wherein said hydrogen ions are implanted at a dose in the range between about 10¹⁶ and 2×

10¹⁷ ions/cm² with an energy in the range between 50 and 150 KeV.

6. The method according to claim 1, wherein said buried layer is formed at a depth between 1 and 2 μ

m beneath a top surface of said bonding layer.

7. The method according to claim 1, wherein said step of heating includes annealing at a range between about 400°

and 600°

C., for a time in the range between about 30 and 120 minutes.

8. The method according to claim 1, wherein said step of bonding said bonding layer to said second wafer comprises hydrophilic bonding.

9. The method according to claim 1, wherein wherein said semiconductor substrate is a Si substrate and said step of bonding said bonding layer to said second wafer comprises the steps of:

forming a layer of silicon dioxide on an exposed surface of said second wafer;

wetting said bonding layer and said silicon dioxide layer;

bringing said bonding layer and said silicon dioxide layer into contact; and

compressing said bonding layer and said silicon dioxide layer to form a bond therebetween.

10. The method according to claim 1, wherein said step of removing the top surface layer and said etch stop layer comprises the steps of:

etching the top surface layer in a first etchant which does not appreciably attack said etch stop layer; and

etching said etch stop layer in a second etchant which does not appreciably attack a remaining part of said device layer.

11. The method according to claim 10, wherein said first etchant comprises a solution of one of potassium hydroxide and ammonium hydroxide.

12. The method according to claim 1, wherein said step of removing said top surface layer and said etch stop layer comprises removing said top surface layer with a low-selectivity etch having a selectivity of 10:

1 or below, followed by removing said etch stop layer with a low selectivity etch of 10;

1 or below.

13. The method according to claim 1, wherein said semiconductor substrate is a Si substrate and said etch stop layer comprises one of a high doped Si layer, a silicon-germanium (Si-Ge) layer, a strained Si-Ge layer, a Ge layer, and a Ge compensated layer of Si-Ge.

14. The method according to claim 1, wherein said etch stop layer is doped with boron at a concentration in the range between 10²⁰ and 10²¹ atoms/cm³.

15. The method according to claim 1, wherein the thickness of said etch stop layer is in the range between 100 and 2000 Å

.

16. The method according to claim 15, wherein the thickness of said etch stop layer is 250 Å

.

17. The method according to claim 1, wherein said step of forming said etch stop layer uses chemical vapor deposition.

18. The method according to claim 1, wherein said semiconductor substrate is a Si substrate and said device layer is one of Si, Ge, and Si-Ge.

19. The method according to claim 18, wherein said device layer is Si-Ge having an atomic percentage of Ge in the range between 5 and 30 percent.

20. The method according to claim 1, wherein said semiconductor substrate is a Si substrate and said device layer comprises at least one of Si, Ge, and Si-Ge.

21. The method according to claim 1, wherein the thickness of the device layer is in the range between 500 and 5000 Å

.

22. The method according to claim 21, wherein the thickness of said device layer is 1000 Å

.

23. The method according to claim 1, further comprising the steps of photolithographically patterning and etching said bonding layer and said device layer to form apertures therein prior to said step of bonding.

24. The method according to claim 1, wherein the semiconductor substrate comprises silicon.

25. A method for forming a thin silicon on insulator structure, comprising:

providing a first wafer comprising a silicon substrate;

forming an etch stop layer having a thickness upon said first wafer;

forming a device layer having a thickness on said etch stop layer;

forming a bonding layer on said device layer;

implanting hydrogen ions into said silicon substrate to form a buried hydrogen-rich layer therein;

forming a layer of silicon dioxide on an exposed surface of a second wafer;

wetting said bonding layer and said silicon dioxide layer;

bringing said bonding layer and said silicon dioxide layer into contact;

compressing said bonding layer and said silicon dioxide layer to form a hydrophilic bond therebetween;

annealing said bonded first and second wafers at a first temperature;

separating said bonded wafers along said buried hydrogen-rich layer so that said second wafer has a top surface layer comprising Si from said first wafer;

annealing said second wafer having said top surface layer to a second temperature;

etching said top surface layer in a first etchant which does not appreciably attack a remaining part of said etch stop layer; and

etching said etch stop layer in a second etchant which does not appreciably attack a remaining part of said device layer;

whereby underlying portions of said device layer remain on the second wafer to form the thin silicon on insulator structure.