Apparatus for making laminated integrated circuit devices

• US 5,892,203 A
• Filed: 05/29/1996
• Issued: 04/06/1999
• Est. Priority Date: 05/29/1996
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Trollinger, Ralph, Stewart, Gary Leon, Jordan, Stanley Robert
• Primary Examiner(s): Walberg, Teresa
• Assistant Examiner(s): PELHAM, JOSEPH MOORE
• Application Number:
  US08/654,999
• Time in Patent Office: 1,042 Days
• Field of Search: 219/385, 219/386, 219/390, 219/393, 219/396, 219/521, 219/405, 219/411, 156/228, 156/264, 156/288, 156/89, 156/321, 29/738, 264/263, 427/553, 427/557, 427/559, 427/585, 427/587, 427/592
• US Class Current: 219/393
• CPC Class Codes: B29C 2043/561 under vacuum conditions
• CPC Class Codes: B29C 43/32 Component parts, details or accessories; Auxiliary operations
• CPC Class Codes: B29C 43/56 Compression moulding under special conditions, e.g. vacuum
• CPC Class Codes: H01L 21/67098 Apparatus for thermal treatment

Abstract

An apparatus for producing laminated integrated circuit cubes includes a hermetically sealable oven chamber. At least one conductive heating device is used to heat the cube to a cure temperature. A vacuum source is connected to the oven chamber to remove gas from between the integrated circuit layers prior to curing. A press device applies pressure to the cube while it is heated under vacuum. A cooling gas is circulated through the oven chamber after curing. A cooling fluid can also be circulated through cooling channels in at least one wall of the oven chamber to cool the chamber.

Claims

1. An apparatus for producing laminated integrated circuit cubes, comprising:

a hermetically sealable oven chamber;

a mechanical press device capable of applying pressure to the cube when the cube is inside the chamber;

at least two conductive heaters for applying conductive heat to at least two portions of said cube, said heaters including an upper heater and a lower heater, each of said heaters comprising a heating element and a cover, said upper heater having structure for contacting said press device, said structure comprising a substantially semispherical surface; and

,

means for creating a vacuum in the chamber.

2. The apparatus of claim 1, wherein at least the upper heater is movable relative to the cube.

3. The apparatus of claim 1, wherein the lower heater is provided in a heating assembly, said heating assembly further comprising structure for fixing the cube in a desired position.

4. The apparatus of claim 3, when said fixing structure includes retractable clamp structure.

5. The apparatus of claim 1, further comprising structure for introducing a cooling gas into said oven chamber.

6. The apparatus of claim 1, further comprising structure for determining the temperature of said cube.

7. The apparatus of claim 6, wherein said structure comprises thermocouples.

8. The apparatus of claim 6, further comprising structure for taking infrared heat measurements of said cubes.

9. The apparatus of claim 1, wherein said oven chamber further comprises infrared-transparent windows for taking infrared measurements of cubes in said oven chamber.

10. The apparatus of claim 1, wherein said windows are provided in a door to said oven chamber.

11. The apparatus of claim 1, further comprising structure for cooling said oven chamber, said structure comprising cooling fluid channels.

12. The apparatus of claim 1, further comprising structure for positioning said cube relative to at least one of said conductive heater and said mechanical press device.

13. The apparatus of claim 1, further comprising a programmable controller, said programmable controller being adapted to control at least one of said conductive heating elements, press device, and a cooling gas.

14. The apparatus of claim 1, wherein said press device comprises a shaft movably mounted through an opening in said enclosure, and comprising hermetic sealing structure about said opening and said shaft.