Semiconductor device assembly with minimized bond finger connections

  • US 5,895,968 A
  • Filed: 10/24/1997
  • Issued: 04/20/1999
  • Est. Priority Date: 10/22/1993
  • Status: Expired due to Term
First Claim
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1. A semiconductor device assembly, comprising:

  • (a) a printed wiring board substrate;

    (b) a planar conductive layer centrally located on a surface of said printed wiring board substrate, the planar conductive layer including one or more conductive segments electrically insulated from one another, each conductive segment adapted for connection thereto, and each conductive segment having portions surrounding a perimeter of an area adapted to receive a semiconductor die;

    (c) a plurality of bond fingers disposed around a periphery of the planar conductive layer and coplanar with the planar conductive layer, the plurality of bond fingers adapted for connection thereto;

    (d) a semiconductor die disposed above the planar conductive layer and within the perimeter of the area adapted to receive the semiconductor die, the semiconductor die having a first and second plurality of bond pads thereon; and

    (e) portions of the one or more conductive segments connected to the first plurality of bond pads, and the plurality of bond fingers connected to the second plurality of bond pads.

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