Method for wire-bonding a covered wire

• US 5,897,049 A
• Filed: 12/05/1996
• Issued: 04/27/1999
• Est. Priority Date: 12/05/1995
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Shinkawa
• Original Assignee: Kabushiki Kaisha Shinkawa
• Inventors: Sasakura, Kazumasa, Nakamura, Osamu
• Primary Examiner(s): Ryan, Patrick
• Assistant Examiner(s): Knapp, Jeffrey T.
• Application Number:
  US08/759,231
• Time in Patent Office: 873 Days
• Field of Search: 228/4.5, 228/180.5, 219/56.21, 219/56.22
• US Class Current: 228/180.5
• CPC Class Codes: B23K 20/007 Ball bonding
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45565 Single coating layer
• CPC Class Codes: H01L 2224/4569 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/78621 Holding means, e.g. wire clampers
• CPC Class Codes: H01L 2224/8503 Reshaping, e.g. forming the ball or the wedge of the wire connector
• CPC Class Codes: H01L 2224/851 the connector being supplied to the parts to be connected in the bonding apparatus
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]

Abstract

To assure the continuity of bonding by preventing any buckling of a covered wire or slipping-off of the covered wire from a second clamper, the second clamper is caused to vibrate while a capillary and first clamper are being raised to a ball formation level after the first clamper is closed and the second clamper is opened in the step of raising the capillary and first clamper to the ball formation level, thus preventing the covered wire from sticking to the second clamper.

Claims

1. A method for wire-bonding a covered wire comprising a process which includes the steps of:

removing a covering-film located at an intended covering-film removal area of the covered wire which extends out from a capillary,

closing a second clamper and opening a first clamper, and lowering the capillary and first clamper so as to bring the covered wire extending out from the tip of the capillary into the interior of the capillary, thus leaving the tip of the covered wire to protrude from the tip of the capillary by only a tail length,

closing the first clamper and opening the second clamper, and raising the capillary and first clamper to a ball formation level, and

forming a ball at the tip of the covered wire;

wherein the second clamper is caused to vibrate while the capillary and first clamper are being raised to the ball formation level after the first clamper is closed and the second clamper is opened in the step of raising the capillary and first clamper to the ball formation level, thus preventing the covered wire from sticking to the second clamper.

2. A method for wire-bonding a covered wire comprising the process which includes:

the steps of;

performing a second bonding operation on a second bonding point;

raising a capillary and a first clamper by a predetermined amount,

closing the first clamper, and raising the capillary and first clamper so as to cut the covered wire from a base of the second bonding point, and

raising the capillary and first clamper so that an intended covering-film removal area of the covered wire extending from the tip of the capillary faces a discharge electrode, and

the steps of;

removing a covering-film located at the intended covering-film removal area of the covered wire extending from the tip of the capillary,

closing a second clamper and opening the first clamper, and lowering the capillary and first clamper so as to bring the covered wire extending from the tip of the capillary into the interior of the capillary, thus leaving the tip of the covered wire to protrude from the tip of the capillary by only a tail length,

closing the first clamper and opening the second clamper, and raising the capillary and first clamper to a ball formation level, and

forming a ball at the tip of the covered wire;

wherein

the second clamper is caused to vibrate while the capillary and first clamper are being raised so that the intended covering-film removal area of the covered wire faces the discharge electrode after the first clamper is closed in the step of having the intended covering-film removal area of the covered wire face the discharge electrode, thus preventing the covered wire from sticking to the second clamper, and

the second clamper is caused to vibrate while the capillary and the first clamper are being raised to the ball formation level after the first clamper is closed and the second clamper is opened in the step of raising the capillary and first clamper to the ball formation level, thus preventing the covered wire from sticking to the second clamper.