Method of holding substrate and substrate holding system

• US 5,906,684 A
• Filed: 03/31/1998
• Issued: 05/25/1999
• Est. Priority Date: 09/16/1993
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Tsubone, Tsunehiko, Takahashi, Kazue, Tamura, Naoyuki, Shichida, Hiroyuki, Ito, Youichi, Ogawa, Yoshifumi
• Primary Examiner(s): Breneman, R. Bruce
• Assistant Examiner(s): Lund, J.
• Application Number:
  US09/050,417
• Time in Patent Office: 420 Days
• Field of Search: 118/724, 118/728, 118/500, 156/345, 279/128, 361/234
• US Class Current: 118/728
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: Y10T 279/23 with magnetic or electrostatic means

Abstract

In a method of holding a substrate and a substrate holding system where, the amount of foreign substances on the back surface of the substrate can be decreased and only a small amount of foreign substances transferred from a mounting table to the substrate. For this purpose, the substrate holding system has a ring-shaped leakage-proof surface providing a smooth support surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions which bear against the substrate on the specimen table between the corresponding position to the periphery of the substrate and the corresponding position to the center of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate is exposed to a cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed at a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact each other in the large portion of the remaining area.

Claims

1. A substrate holding system for holding a substrate on a specimen table, and supplying a back side gas between the specimen table and said substrate, which comprises:

a periphery holding portion having a surface disposed on said specimen table in a position corresponding to the periphery of said substrate;

an internal holding portion disposed on said specimen table to support said substrate at a corresponding position between the periphery of said substrate and the center of said substrate; and

electrostatic attraction means for fixing said substrate on said holder so that the back surface of said substrate contacts the periphery holding portion and the internal holding portion,

wherein the back side gas is supplied through a feed hole located in a recessed portion of the specimen table;

wherein the internal holding portion includes a through hole and a pin for pushing the substrate off of the specimen table.

2. A substrate holding system according to claim 1, wherein the height of the periphery holding portion and the internal holding portion is 15 μ

m˜

200 μ

m.

3. A substrate holding system according to claim 1, wherein the area of the periphery holding portion and the internal holding portion which contacts the substrate is less than one half of the area of the substrate.

4. A substrate holding system according to claim 1, wherein the recessed portion of the specimen table is located under the center of the substrate.

5. A substrate holding system in a plasma treatment apparatus having a vacuum treating chamber, gas introducing means and a specimen table mounting a substrate in the vacuum treating chamber where the substrate is held to the specimen table with electrostatic adhesion force, comprising:

a periphery holding portion having a surface protruding from a holding member in a position corresponding to the periphery of the substrate; and

an internal holding portion disposed on said holding member to support said substrate at a corresponding position between the periphery of said substrate and the center of said substrate;

wherein said substrate holding system further comprises;

electrostatic attraction means for fixing said substrate on said holder so that the back surface of said substrate contacts the periphery holding portion and the internal holding portion,

wherein the back side gas is supplied through a feed hole located in a recessed portion of the specimen table; and

wherein the internal holding portion has a through hole and a pin for pushing the substrate off of the specimen table.

6. A substrate holding system according to claim 5, wherein the recessed portion of the specimen table is located under the center of the substrate.

7. A substrate holding system which holds a substrate on a specimen table, and supplies a back side gas between the specimen table and said substrate, which comprises:

a periphery holding portion having a surface disposed on said specimen table in a position corresponding to the periphery of said substrate;

an internal holding portion disposed on said specimen table to support said substrate at a corresponding position between the periphery of said substrate and the center of said substrate; and

electrostatic attraction circuitry to generate electrostatic attraction at the specimen table to fix said substrate on said holder so that the back surface of said substrate contacts the periphery holding portion and the internal holding portion,

wherein the back side gas is supplied through a feed hole located in a recessed portion of the specimen table, and

wherein the internal holding portion includes a through hole and a pin to push the substrate off the specimen table.

8. A substrate holding system according to claim 7, wherein the electrostatic attraction circuitry is adjustable to control the amount of electrostatic attraction at the specimen table.

9. A substrate holding system according to claim 7, wherein the recessed portion of the specimen table is located under the center of the substrate.

10. A substrate holding system for holding a substrate on a specimen table, and supplying a back side gas between the specimen table and said substrate, which comprises:

a periphery holding portion having a surface disposed on said specimen table in a position corresponding to the periphery of said substrate;

an internal holding portion disposed on said specimen table to support said substrate at a corresponding position between the periphery of said substrate and the center of said substrate, wherein the internal holding portion is separated from the periphery holding portion by a recessed portion in the specimen table; and

electrostatic attraction means for fixing said substrate on said holder so that the back surface of said substrate contacts the periphery holding portion and the internal holding portion,

wherein the internal holding portion includes a through hole and a pin for pushing the substrate off of the specimen table.

11. A substrate holding system according to claim 10, wherein the height of the periphery holding portion and the internal holding portion is 15 μ

m˜

200 μ

m.

12. A substrate holding system according to claim 10, wherein the area of the periphery holding portion and the internal holding portion which contacts the substrate is less than one half of the area of the substrate.

13. A substrate holding system according to claim 10, wherein the back side gas is supplied through a feed hole located in a second recessed portion of the specimen table.

14. A substrate holding system according to claim 13, wherein the second recessed portion of the specimen table is located under the center of the substrate.

15. A substrate holding system in a plasma treatment apparatus having a vacuum treating chamber, gas introducing means and a specimen table mounting a substrate in the vacuum treating chamber where the substrate is held to the specimen table with electrostatic adhesion force, comprising:

a periphery holding portion having a surface protruding from a holding member in a position corresponding to the periphery of the substrate; and

an internal holding portion disposed on said holding member to support said substrate at a corresponding position between the periphery of said substrate and the center of said substrate, wherein the internal holding portion is separated from the periphery holding portion by a recessed portion in the specimen table;

wherein said substrate holding system further comprises;

electrostatic attraction means for fixing said substrate on said holder so that the back surface of said substrate contacts the periphery holding portion and the internal holding portion,

wherein the internal holding portion has a through hole and a pin for pushing the substrate off of the specimen table.

16. A substrate holding system according to claim 15, wherein the back side gas is supplied through a feed hole located in a second recessed portion of the specimen table.

17. A substrate holding system according to claim 16, wherein the second recessed portion of the specimen table is located under the center of the substrate.

18. A substrate holding system which holds a substrate on a specimen table, and supplies a back side gas between the specimen table and said substrate, which comprises:

a periphery holding portion having a surface disposed on said specimen table in a position corresponding to the periphery of said substrate;

an internal holding portion disposed on said specimen table to support said substrate at a corresponding position between the periphery of said substrate and the center of said substrate, wherein the internal holding portion is separated from the periphery holding portion by a recessed portion in the specimen table; and

electrostatic attraction circuitry to generate electrostatic attraction at the specimen table to fix said substrate on said holder so that the back surface of said substrate contacts the periphery holding portion and the internal holding portion,

wherein the internal holding portion includes a through hole and a pin to push the substrate off the specimen table.

19. A substrate holding system according to claim 18, wherein the electrostatic attraction circuitry is adjustable to control the amount of electrostatic attraction at the specimen table.

20. A substrate holding system according to claim 18, wherein the back side gas is supplied through a feed hole located in a second recessed portion of the specimen table.

21. A substrate holding system according to claim 20, wherein the second recessed portion of the specimen table is located under the center of the substrate.