Method and system for fabricating and testing assemblies containing wire bonded semiconductor dice

  • US 5,918,107 A
  • Filed: 04/13/1998
  • Issued: 06/29/1999
  • Est. Priority Date: 04/13/1998
  • Status: Expired due to Term
First Claim
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1. A method for fabricating and testing an electronic assembly comprising:

  • providing a substrate comprising a plurality of first pads;

    providing a semiconductor die comprising a plurality of second pads, and a plurality of integrated circuits in electrical communication with the second pads;

    wire bonding the first pads to the second pads to form wire bonded electrical connections therebetween;

    verifying electrical continuity in the wire bonded electrical connections; and

    prior to further processing of the assembly, applying test signals through the first pads, the wire bonded electrical connections, and the second pads to the integrated circuits, to evaluate electrical characteristics of the die or assembly.

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