Interconnection method for a multilayer transducer array

• US 5,920,972 A
• Filed: 06/27/1997
• Issued: 07/13/1999
• Est. Priority Date: 06/27/1997
• Status: Expired due to Term

• Current Assignee: Siemens Medical Solutions USA Incorporated (Siemens AG)
• Original Assignee: Siemens Medical Systems, Inc. (Siemens AG)
• Inventors: Palczewska, Grazyna, Ho, Ron, Persatieva, Inessa
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US08/883,778
• Time in Patent Office: 746 Days
• Field of Search: 29/25.35, 310/334-337
• US Class Current: 29/25.35
• CPC Class Codes: B06B 1/064 with multiple active layers
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

A method of providing connections to an arrangement of multilayer transducer elements of an ultrasonic transducer array includes patterning an electrically conductive layer on a substrate to define a number of traces and a wide-area continuous region. At least a portion of the substrate is then removed to expose both of the upper and lower surfaces of the wide-area conductive region. The exposed upper and lower surfaces are captured between first and second piezoelectric layers such that the conductive layer electrically contacts both of the piezoelectric layers. The captured wide-area continuous region and at least one of the piezoelectric layers are diced to define the array of transducer elements. The traces that are formed during the patterning step are arranged such that there is a one-to-one correspondence between the traces and the electrodes that are defined by segmenting the wide-area continuous region during the dicing step.

Claims

1. A method of providing connections to an arrangement of multilayer transducer elements of an ultrasonic transducer array comprising steps of:

forming electrically conductive material on a substrate in a pattern that includes traces having correspondence to said arrangement of multilayer transducer elements;

removing at least a portion of said substrate while maintaining said pattern of conductive material intact, thereby providing an unsupported region of said pattern in which opposed first and second surfaces of said pattern are exposed; and

capturing at least a portion of said unsupported region between first and second piezoelectric layers of said transducer array such that said first and second surfaces of said pattern respectively contact said first and second piezoelectric layers.

2. The method of claim 1 wherein said step of removing at least a portion of said substrate includes leaving a peripheral portion of said substrate to retain alignment of said traces, and wherein said step of capturing said unsupported region includes positioning said peripheral portion beyond edges of said first and second piezoelectric layers.

3. The method of claim 1 further comprising a step of defining said transducer elements from said first and second piezoelectric layers, including cutting into at least one of said piezoelectric layers and through said pattern of conductive material.

4. The method of claim 3 wherein said step of forming said electrically conductive material on said substrate includes providing a wide-area region that generally corresponds to said portion of said unsupported region which is captured between said first and second piezoelectric layers, said step that includes cutting through said pattern of conductive material thereby dividing said wide-area region into an array of electrodes.

5. The method of claim 4 wherein said step of forming said electrically conductive material includes forming said traces such that each trace is electrically connected to a single electrode following said step that includes cutting through said pattern.

6. The method of claim 1 wherein said step of forming said electrically conductive material includes depositing a metallic layer on a flexible dielectric substrate.

7. The method of claim 1 wherein said step of forming said electrically conductive material includes patterning a leadframe having said traces extending from opposite sides of a central metallic region that has dimensions generally corresponding to dimensions of said first and second piezoelectric layers, each of said traces being operatively associated with a different transducer element.

8. The method of claim 7 further comprising providing an electrical ground connection along sides of said first and second piezoelectric layers opposite to contact with said unsupported region of said pattern of conductive material.

9. A method of forming an ultrasonic transducer array having multilayer transducer elements comprising steps of:

forming a conductive layer on a flexible substrate of dielectric material such that said conductive layer includes a continuous region having longitudinal and transverse dimensions that substantially correspond to longitudinal and transverse dimensions of said transducer array, said conductive layer having traces extending from said continuous region;

removing said flexible substrate from contact with said continuous region, thereby exposing opposite sides of said conductive layer;

attaching first and second piezoelectric layers to said exposed opposite sides of said conductive layer such that said piezoelectric layers are aligned with and contact said continuous region, thereby forming a laminated structure having said traces extending therefrom; and

removing material from said laminated structure to form a plurality of said multilayer transducer elements, including segmenting said continuous region into an array of electrodes.

10. The method of claim 9 wherein said step of attaching said first and second piezoelectric layers includes bonding said piezoelectric layers to said conductive layer.

11. The method of claim 9 wherein said step of removing said flexible substrate includes leaving a peripheral portion of said substrate to maintain said traces in alignment.

12. The method of claim 9 wherein said step of removing material from said laminated structure includes dicing at least one of said piezoelectric layers.

13. The method of claim 9 wherein said step that includes segmenting said continuous region includes providing a one-to-one relationship between said electrodes and said traces.

14. The method of claim 9 wherein said step of removing said flexible substrate from contact with said continuous region is a step of etching a central region of said flexible substrate while leaving outer portions for supporting said traces.