Air-cooled electronic apparatus with condensation prevention

• US 5,934,368 A
• Filed: 09/19/1995
• Issued: 08/10/1999
• Est. Priority Date: 09/20/1994
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Takanashi, Akihiro, Kobayashi, Junichi, Tanaka, Tetsuya, Watanabe, Yutaka, Atarashi, Takayuki, Daikoku, Takahiro, Zushi, Shizuo, Hatada, Toshio
• Primary Examiner(s): Ford, John K.
• Application Number:
  US08/530,670
• Time in Patent Office: 1,421 Days
• Field of Search: 165/80.3, 165/231, 165/233, 236/44 R, 236/44 A, 62/259.2, 62/94, 62/271, 62/176.1, 62/176.5, 62/176.6, 361/696, 361/695
• US Class Current: 165/233
• CPC Class Codes: F24F 11/0008 for air-humidification F24F11/30 takes precedence
• CPC Class Codes: G05D 22/02 characterised by the use of electric means
• CPC Class Codes: G05D 23/1931 to control the temperature of one space
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20572 within cabinets for removing heat from sub-racks, e.g. plenum
• CPC Class Codes: H05K 7/207 Thermal management, e.g. cabinet temperature control

Abstract

A highly reliable electronic apparatus free from condensation in the cabinet of the apparatus. The electronic apparatus has printed circuit boards on which heat emitting semiconductor devices are mounted and a fan. The electronic apparatus further comprises a hygrometer for measuring the relative humidity and dew-point temperature of the cooling air that is introduced into the cabinet through an opening, a surface temperature sensor for sensing the temperature of the surface of the semiconductor devices, an internal temperature sensor for sensing the internal temperature of the semiconductor device, dehumidifier and heater means made up of a heat pump and an outdoor unit, and a controller for controlling the dehumidifier means and the heater means so that the relative humidity is less than 100% and the dew-point temperature is less than the surface temperature of the semiconductor devices.

Claims

1. An electronic apparatus comprising:

a plurality of semiconductor devices;

a cabinet enclosing said semiconductor devices;

a fan to introduce an air flow of external air into the cabinet through a first air inlet, which air flow directly contacts said semiconductor devices;

a humidity sensor for measuring relative humidity of the air flow;

a temperature sensor for measuring a temperature of the semiconductor devices;

a heater disposed in said air flow through said first air inlet, upstream of the semiconductor devices for heating the air flow in response to measured values of said sensors; and

a second air inlet disposed in parallel fluid flow with said first air inlet;

wherein said temperature sensor comprises means for determining an internal temperature of the semiconductor devices.

2. An electronic apparatus comprising:

a plurality of semiconductor devices;

a cabinet enclosing said semiconductor devices;

a fan to introduce an air flow of external air into the cabinet through a first air inlet, which air flow directly contacts said semiconductor devices;

a sensor for measuring relative humidity of the air flow;

a sensor for measuring temperature of the semiconductor devices;

a heater disposed in said air flow through said first air inlet, upstream of the semiconductor devices for heating the air flow;

a dehumidifier comprising a hygroscopic compound for dehumidifying air introduced through said first air inlet upstream of the semiconductor devices in the flow of air;

a second air inlet disposed in parallel fluid flow with said first air inlet; and

means for controlling one of the heater and the dehumidifier in response to an output of said sensors;

wherein said sensor for measuring temperature includes a sensor for measuring an internal temperature of the semiconductor devices.

3. The electronic device according to claim 2, wherein dehumidifier includes opening/closing means for regulating an air flow through said heater and said hygroscopic compound.

4. An arrangement for controlling temperature and humidity in an electronic unit having a plurality of semiconductor devices enclosed in a housing, said arrangement comprising:

a first air inlet for guiding a flow of air into said housing;

a second air inlet for guiding a flow of air into said housing;

a heating component disposed in said second air inlet;

a dehumidifier component disposed in said second air inlet in sequence with said heating component;

a damper for controlling a relative flow of air through said first and second inlets;

a sensor arrangement for sensing temperature and relative humidity of air flow through said first and second air inlet and for sensing a temperature of said semiconductor devices; and

a controller for controlling said heating component and said damper in response to outputs from said sensor arrangement.

5. The arrangement according to claim 4 wherein, when said relative humidity reaches a preset value, or when said temperature of the semiconductor devices is lower than a dew point temperature of air in said air flow, said controller opens said damper, allowing external air to flow through the dehumidifier component.

6. The arrangement according to claim 5 wherein:

when a temperature of said semiconductor devices is less than a predetermined value, said controller activates said heating component to continuously heat said flow of air through said second air inlet; and

when the temperature of the semiconductor devices is greater than a predetermined value, said controller deactivates said heating component.

7. The arrangement according to claim 6 wherein when said relative humidity is less than said preset value, and when the temperature of the semiconductor devices is above said dew point temperature, said controller causes said damper to open and said heating component to operate.