Test head for IC tester
First Claim
1. An IC tester comprising:
- a plurality of pin-electronics-cards provided inside a test head and connected to devices to be tested;
a waveform shaper outside of the test head for supplying waveform signals to the pin-electronics-cards;
a receiver card inside the test head for receiving the waveform signals shaped at the waveform shaper;
a single signal line connecting the waveform shaper to the receiver card;
a back board provided inside the test head for receiving the waveform signals from the receiver card and supplying the waveform signals from the receiver card to the pin-electronics-cards via a printed wiring pattern; and
a termination card at an end of the printed wiring pattern provided on the back board for terminating the waveform signals originating from the receiver card.
2 Assignments
0 Petitions
Accused Products
Abstract
To provide a test head for an IC tester wherein identical test signals can be distributed to a plurality of devices to be tested while holding in check an increase in the number of signal lines connecting a waveform shaper to the test head, upsizing of the test head, and an increase in power consumption. A plurality of pin-electronics-cards are connected with each other via a printed wiring pattern on a back board provided inside a test head, a waveform signal shaped at a waveform shaper is received by a receiver card provided in the test head and the waveform signal delivered from the receiver card is distributed to the plurality of the pin-electronics-cards via the printed wiring pattern provided on the back board while the end of the printed wiring pattern is terminated at the termination card.
61 Citations
11 Claims
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1. An IC tester comprising:
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a plurality of pin-electronics-cards provided inside a test head and connected to devices to be tested; a waveform shaper outside of the test head for supplying waveform signals to the pin-electronics-cards; a receiver card inside the test head for receiving the waveform signals shaped at the waveform shaper; a single signal line connecting the waveform shaper to the receiver card; a back board provided inside the test head for receiving the waveform signals from the receiver card and supplying the waveform signals from the receiver card to the pin-electronics-cards via a printed wiring pattern; and a termination card at an end of the printed wiring pattern provided on the back board for terminating the waveform signals originating from the receiver card.
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2. An IC tester comprising:
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a waveform shaper for supplying shaped waveform signals; and a test head including; (a) a receiver card for receiving the waveform signals from the waveform shaper, the waveform shaper being located outside of the test head, the receiver card outputting a plurality of the waveform signals; (b) a back board having a printed wiring pattern thereon, the back board receiving the plurality of the waveform signals at the printed wiring pattern thereon, and the receiver card being secured to a first end of the back board; and (c) a plurality of pin-electronics-cards connected to the printed wiring pattern on the back board so that each pin-electronics-card receives one of the plurality of the waveform signals from the wiring pattern on the back board, each of the pin-electronics-cards being connected to a device to be tested to apply the respective waveform signal thereto. - View Dependent Claims (3, 4, 5, 6, 7)
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8. An IC tester comprising:
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a waveform shaper for supplying shaped waveform signals; and a test head including; (a) a back board provided having a printed wiring pattern thereon for receiving the waveform signals from the waveform shaper; (b) a plurality of pin-electronics-cards connected to the printed wiring pattern of the back board so that each of the pin-electronics-cards receives one of the multiple waveform signals from the wiring pattern, each of the pin-electronics-cards being connected to a device to be tested to apply the respective waveform signal thereto; and (c) a termination card secured to the back board for terminating the waveform signals to prevent reflections of the waveform signals from interfering with testing of the devices. - View Dependent Claims (9, 10, 11)
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Specification