Method of forming a circuit board

• US 5,937,512 A
• Filed: 01/11/1996
• Issued: 08/17/1999
• Est. Priority Date: 01/11/1996
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Communications, Inc. (Micron Technology, Inc.)
• Inventors: Tuttle, Mark E., Lake, Rickie C., Mousseau, Joe
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US08/585,428
• Time in Patent Office: 1,314 Days
• Field of Search: 29/848, 29/849, 29/832, 29/840, 156/233
• US Class Current: 29/832
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49883 the conductive materials containing organic materials or pastes, e.g. for thick films for printed circuits H05K1/092
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2203/0152 Temporary metallic carrier, e.g. for transferring material affixing a prefabricated conductor pattern formed by electroplating or electroforming on a metallic carrier H05K3/205
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/0759 Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49158 : with molding of insulated base

Abstract

A method of forming a circuit board includes, a) providing a temporary substrate; b) depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate; c) substantially curing the uncured circuit board material into at least one self supporting sheet; d) providing circuit traces atop the cured self supporting sheet; e) mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and f) peeling the temporary substrate and cured self supporting sheet from one another. An electronic circuit of the invention includes, i) a self-supporting electrically insulative ink or paint substrate, the ink or paint substrate having an outer surface; ii) circuit traces provided on the ink or paint substrate outer surface; and iii) at least one electronic circuit component mounted to the ink or paint substrate outer surface in electrical connection with the circuit traces.

Claims

1. A method of forming a circuit board comprising the following steps:

providing a temporary substrate;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate;

substantially curing the uncured circuit board material into at least one self supporting sheet;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and

peeling the temporary substrate and cured self supporting sheet from one another.

2. The method of forming a circuit board of claim 1 comprising reusing the temporary substrate in a subsequent method comprising the collective steps of claim 1.

3. The method of forming a circuit board of claim 1 wherein the temporary substrate predominately comprises a material selected from the group consisting of glass, metal foil, ceramic, wax, wax-coated paper, polyester, Teflon®

, plastic, and mixtures thereof.

4. The method of forming a circuit board of claim 1 wherein the circuit board material predominately comprises a material selected from the group consisting of epoxy, polyester resin, polyurethanes, paint, varnish, and mixtures thereof.

5. The method of forming a circuit board of claim 1 wherein the temporary substrate is rigid.

6. The method of forming a circuit board of claim 1 wherein the cured circuit board material is rigid.

7. The method of forming a circuit board of claim 1 wherein the temporary substrate is rigid, and the cured circuit board material is rigid.

8. The method of forming a circuit board of claim 1 wherein the circuit traces and mounted electronic circuit component are provided before the peeling step.

9. The method of forming a circuit board of claim 1 wherein the circuit traces and mounted electronic circuit component are provided after the peeling step.

10. A method of forming a circuit board comprising the following steps:

providing a temporary substrate;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate, the electrically insulative circuit board material predominately comprising ink,

substantially curing the uncured circuit board material into at least one self supporting sheet;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and

peeling the temporary substrate and cured self supporting sheet from one another.

11. A method of forming a circuit board comprising the following steps:

providing a temporary substrate;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate, the electrically insulative circuit board material predominately comprising ink;

substantially curing the uncured circuit board material into at least one self supporting sheet;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces;

peeling the temporary substrate and cured self supporting sheet from one another; and

reusing the temporary substrate in a subsequent method comprising the above collective steps.

12. A method of forming a circuit board comprising the following steps:

providing a temporary substrate;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate, the electrically insulative circuit board material predominately comprising ultraviolet light curable ink substantially curing comprising exposing the ink to ultraviolet light;

substantially curing the uncured circuit board material into at least one self supporting sheet, the substantially curing comprising exposing the ink to ultraviolet light;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and

peeling the temporary substrate and cured self supporting sheet is from one another.

13. A method of forming a circuit board comprising the following steps:

providing a temporary substrate, wherein the temporary substrate is flexible;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate;

substantially curing the uncured circuit board material into at least one self supporting sheet;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and

peeling the temporary substrate and cured self supporting sheet from one another.

14. A method of forming a circuit board comprising the following steps:

providing a temporary substrate;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate;

substantially curing the uncured circuit board material into at least one self supporting sheet, wherein the cured circuit board material is flexible;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and

peeling the temporary substrate and cured self supporting sheet from one another.

15. A method of forming a circuit board comprising the following steps:

providing a temporary substrate, the temporary substrate being flexible;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate;

substantially curing the uncured circuit board material into at least one self supporting sheet, the cured circuit board material being flexible;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and

peeling the temporary substrate and cured self supporting sheet from one another.

16. A method of forming a circuit board comprising the following steps:

providing a temporary substrate, the temporary substrate being rigid;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate;

to substantially curing the uncured circuit board material into at least one self supporting sheet, the cured circuit board material being flexible;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and

peeling the temporary substrate and cured self supporting sheet from one another.

17. A method of forming a circuit board comprising the following steps:

providing a temporary substrate, the temporary substrate being flexible;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate;

substantially curing the uncured circuit board material into at least one self supporting sheet, the cured circuit board material being rigid;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and

peeling the temporary substrate and cured self supporting sheet from one another.

18. A method of forming a circuit board comprising the following steps:

providing a temporary substrate;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate;

substantially curing the uncured circuit board material into at least one self supporting sheet;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces, the mounting comprising mounting the electronic circuit component with electrically conductive epoxy; and

peeling the temporary substrate and cured self supporting sheet from one another.

19. A method of forming a circuit board comprising the following steps:

providing a temporary substrate;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the temporary substrate;

substantially curing the uncured circuit board material into at least one self supporting sheet;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces;

providing an electrically insulative encapsulating layer over the cured circuit board material having the circuit traces and electronic circuit component;

after providing the electrically insulative encapsulating layer, peeling the temporary substrate and cured self supporting sheet from one another, the peeling step comprising peeling a composite of the circuit board sheet and encapsulating layer from the temporary substrate; and

after the peeling step, cutting through at least the encapsulating layer to form a plurality of discrete encapsulated circuit boards having circuit traces and at least one mounted electronic circuit component.

20. The method of forming a circuit board of claim 19 wherein the temporary substrate is flexible, the cured circuit board material is flexible, and the encapsulating layer is flexible.

21. The method of forming a circuit board of claim 19 wherein the temporary substrate is flexible, the cured circuit board material is rigid, and the encapsulating layer is flexible.

22. The method of forming a circuit board of claim 19 wherein the temporary substrate is flexible, the cured circuit board material is flexible, and the encapsulating layer is rigid.

23. The method of forming a circuit board of claim 19 wherein the temporary substrate is flexible, the cured circuit board material is rigid, and the encapsulating layer is rigid.

24. The method of forming a circuit board of claim 19 wherein the temporary substrate is rigid, the cured circuit board material is flexible, and the encapsulating layer is flexible.

25. The method of forming a circuit board of claim 19 wherein the temporary substrate is rigid, the cured circuit board material is rigid, and the encapsulating layer is flexible.

26. The method of forming a circuit board of claim 19 wherein the temporary substrate is rigid, the cured circuit board material is flexible, and the encapsulating layer is rigid.

27. The method of forming a circuit board of claim 19 wherein the temporary substrate is rigid, the cured circuit board material is rigid, and the encapsulating layer is rigid.

28. A method of forming a circuit board comprising the following steps:

providing a temporary substrate;

depositing an uncured electrically insulative circuit board material over the temporary substrate, the circuit board material adhering to the a temporary substrate;

substantially curing the uncured circuit board material into at least one self supporting sheet;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces;

peeling the temporary substrate and cured self supporting sheet from one another, the circuit traces and mounted electronic circuit component being provided before the peeling step;

providing an electrically insulative encapsulating layer over the cured circuit board material having the circuit traces and electronic circuit component provided thereon before the peeling step;

cutting through the encapsulating layer and temporary substrate to form a plurality of discrete circuit boards having circuit traces and at least one mounted electronic circuit component; and

the peeling step comprising peeling a plurality of composite circuit boards with encapsulating layer material from the respectively cut pieces of temporary substrate.

29. A method of forming a circuit board comprising the following steps:

providing a temporary substrate;

providing a series of discrete patterns of an uncured electrically insulative circuit board material over the temporary substrate, the discrete patterns forming desired outlines of a plurality of finished circuit boards, the circuit board material adhering to the temporary substrate;

substantially curing the uncured circuit board material into a plurality of self supporting circuit board sheets;

providing circuit traces atop the plurality of cured self supporting circuit board sheets;

mounting electronic circuit components atop the plurality of cured self supporting sheets in electrical communication with the circuit traces; and

after providing the circuit traces and mounting the electronic circuit components, peeling the temporary substrate and plurality of cured self supporting sheets from one another.

30. The method of forming a circuit board of claim 29 comprising reusing the temporary substrate in a subsequent method comprising the collective steps of claim 29.

31. The method of forming a circuit board of claim 29 wherein the electrically insulative circuit board material predominately comprises ink.

32. The method of forming a circuit board of claim 29 comprising reusing the temporary substrate in a subsequent method comprising the collective steps of claim 29, and wherein the electrically insulative circuit board material predominately comprises ink.

33. The method of forming a circuit board of claim 29 wherein the electrically insulative circuit board material predominately comprises ultraviolet light curable ink, the step of substantially curing comprising exposing the ink to ultraviolet light.

34. The method of forming a circuit board of claim 29 wherein the temporary substrate predominately comprises a material selected from the group consisting of glass, metal foil, ceramic, wax, wax-coated paper, polyester, Teflon®

, plastic, and mixtures thereof.

35. The method of forming a circuit board of claim 29 wherein the circuit board material predominately comprises a material selected from the group consisting of epoxy, polyester resin, polyurethanes, paint, varnish, and mixtures thereof.

36. The method of forming a circuit board of claim 29 further comprising:

providing an electrically insulative encapsulating layer over the cured circuit board material having the circuit traces and electronic circuit components provided thereon before the peeling step, the peeling step comprising peeling a singular composite of the plurality of the circuit board sheets and encapsulating layer from the temporary substrate, and further comprising;

after the peeling step, cutting through the encapsulating layer to form a plurality of discrete encapsulated circuit boards having circuit traces and at least one mounted electronic circuit component.

37. The method of forming a circuit board of claim 29 further comprising:

providing an electrically insulative encapsulating layer over the cured circuit board material having the circuit traces and electronic circuit components provided thereon before the peeling step;

cutting through the encapsulating layer and temporary substrate to form a plurality of discrete circuit boards having circuit traces and at least one mounted electronic circuit component; and

the peeling step comprising peeling a plurality of composite circuit boards with encapsulating layer material from the respectively cut pieces of temporary substrate.

38. The method of forming a circuit board of claim 29 further comprising:

providing a series of discrete dams around the respective cured circuit board sheets;

providing an electrically insulative encapsulating layer within the dams over the cured circuit board sheets and after providing the circuit traces and after mounting the electronic circuit components to define a plurality of discrete encapsulated circuit board sheets; and

the peeling step comprising peeling the respective encapsulated circuit board sheets from the temporary substrate.

39. A method of forming a circuit board comprising:

providing a temporary substrate;

depositing an uncured electrically insulative circuit board material proximate the temporary substrate, the circuit board material adhering to the temporary substrate;

substantially curing the uncured circuit board material into at least one self supporting sheet;

after the substantially curing, providing circuit traces proximate the cured self supporting sheet;

mounting an electronic circuit component in electrical communication with the circuit traces; and

removing the temporary substrate from the substantially cured self supporting sheet.

40. A method of forming a circuit board comprising the following steps:

providing a temporary substrate;

depositing an uncured electrically insulative circuit board material over the temporary substrate;

substantially curing the uncured circuit board material into at least one self supporting sheet, the at least one self supporting sheet consisting essentially of the substantially cured circuit board material;

providing circuit traces atop the cured self supporting sheet;

mounting an electronic circuit component atop the cured self supporting sheet in electrical communication with the circuit traces; and

removing the cured self supporting sheet from the temporary substrate.