Solid state electrochemical sensors

• US 5,944,970 A
• Filed: 04/29/1997
• Issued: 08/31/1999
• Est. Priority Date: 04/29/1997
• Status: Expired due to Fees

• Current Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Rosenblatt, David
• Primary Examiner(s): TUNG, TA HSUNG
• Application Number:
  US08/841,031
• Time in Patent Office: 854 Days
• Field of Search: 204/416, 204/418, 204/419, 204/420, 257/253
• US Class Current: 204/416
• CPC Class Codes: G01N 27/4148 Integrated circuits therefor, e.g. fabricated by CMOS processing CMOS processing per se H01L21/82

Abstract

A solid state electrochemical sensor includes a conductive base layer which supports a chemically sensitive membrane, a guard ring layer located below the base layer and insulated therefrom by a dielectric insulator ring layer. The two ring layers define a central hole through which access to the underside of the base layer is provided. The side wall of the hole is coated with a dielectric oxide layer and a metal conductor is laid on the oxide layer and is ohmically bonded to the base layer. A second dielectric oxide layer covers the metal conductor and a metallic inner guard layer covers the second dielectric oxide layer and is in ohmic contact with the guard ring layer. A CMOS buffer amplifier (voltage follower amplifier) is formed on the lower surface of the guard ring layer. The input to the buffer amplifier is coupled to the conductor in ohmic contact with the base layer and the output of the buffer amplifier is coupled to the guard ring. The guard ring and the metallic inner guard layer form an active shield (guard) around the conductor which transmits the potential of the membrane to the amplifier. The amplifier powers the guard to the same potential as the membrane which insures that the membrane potential is read properly without corruption due to capacitive loading by parasitics, shorting caused by leakage currents, or capacitively coupled noise.

Claims

1. A solid state sensor device, comprising:

a) an ion-sensitive membrane mounted on an upper surface of said device;

b) a first electrically conductive layer electrically coupled to said membrane and extending through said device to a lower surface of said device;

c) a second electrically conductive layer substantially surrounding said first electrically conductive layer and being electrically insulated therefrom;

d) a third electrically conductive layer electrically coupled to said second electrically conductive layer and electrically insulated from said first electrically conductive layer with said first electrically conductive layer lying between said second electrically conductive layer and said third electrically conductive layer, wherein

said second electrically conductive layer and said third electrically conductive layer form a conductive shield around said first electrically conductive layer.

2. A solid state device according to claim 1, further comprising:

e) a voltage-follower amplifier formed on said lower surface of said device, said amplifier having an input and an output, said input being electrically coupled to said first electrically conductive layer and said output being electrically coupled to said second and third electrically conductive layers.

3. A solid state device according to claim 1, wherein:

each of said first, second and third electrically conductive layers exhibit a portion which is skewed relative to said upper and lower surfaces.

4. A solid state device according to claim 3, wherein:

each of said first, second and third electrically conductive layers exhibit a substantially circular cross section.

5. A solid state device according to claim 1, further comprising:

e) an upper conductive base member defining said upper surface; and

f) a lower ring member defining said lower surface and defining a central throughbore having a side wall, wherein

said first, second and third electrically conductive layers are formed in part as layers on said side wall.

6. A solid state device according to claim 5, further comprising:

g) a dielectric ring member interposed between said upper conductive base member and said lower ring member.

7. A solid state device according to claim 6, wherein:

said upper conductive member is P+ polysilicon.

8. A solid state device according to claim 7, wherein:

said lower ring member is degenerately doped P+.

9. A solid state device according to claim 8, wherein:

said dielectric ring member is a thermal oxide.

10. A solid state device according to claim 8, wherein:

said dielectric ring member is silicon dioxide.

11. A solid state electrochemical sensor, comprising:

a) a conductive base layer having an upper surface and a lower surface;

b) a chemically sensitive membrane mounted on said upper surface of said base layer;

c) a dielectric ring layer having an upper surface and a lower surface, said upper surface of said dielectric ring layer contacting said lower surface of said base layer;

d) a guard ring layer having an upper surface and a lower surface, said upper surface of said guard ring layer contacting said lower surface of said dielectric ring layer, said guard ring layer and said dielectric ring layer defining a central hole having a side wall which terminates at the lower surface of said base layer, said guard ring layer having an electrically conductive portion on said side wall;

e) a first dielectric oxide layer coating said side wall;

f) a first conductive layer coating said first dielectric oxide layer and being electrically coupled to said base layer;

g) a second dielectric oxide layer coating said first conductive layer; and

h) a second conductive layer coating said second dielectric oxide layer and being electrically coupled to said electrically conductive portion of said guard ring layer.

12. A sensor according to claim 11, further comprising:

i) a voltage-follower amplifier formed on said lower surface of said guard ring layer, said amplifier having an input and an output, said input being electrically coupled to said first conductive layer and said output being electrically coupled to said second conductive layer.

13. A sensor according to claim 11, wherein:

said conductive base layer is P+ polysilicon.

14. A sensor according to claim 13, wherein:

said guard ring layer is degenerately doped P+.

15. A sensor according to claim 14, wherein:

said dielectric ring layer is a thermal oxide.

16. A sensor according to claim 14, wherein:

said dielectric ring layer is silicon dioxide.