Methods of making semiconductor chip assemblies

  • US 5,950,304 A
  • Filed: 05/21/1997
  • Issued: 09/14/1999
  • Est. Priority Date: 09/24/1990
  • Status: Expired due to Fees
First Claim
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1. A method of making a semiconductor chip assembly comprising the steps of:

  • (a) providing a semiconductor chip having a front surface defining the top of the chip, said front surface including a central region and a peripheral region surrounding said central region, whereby said central region is disposed inwardly of said peripheral region, said chip having central contacts disposed in said central region of said front surface;

    (b) assembling a dielectric element to said chip so that said dielectric element overlies said chip front surface, said dielectric element having a first surface facing towards said chip and a second surface facing away from said chip, a plurality of terminals disposed on said dielectric element and a hole encompassing said central contacts with an edge bounding said hole;

    (c) connecting a plurality of central contact leads between at least some of said central contacts and at least some of said terminals on said dielectric element.

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