Solid-state image sensing apparatus and manufacturing method thereof

  • US 5,952,714 A
  • Filed: 06/16/1997
  • Issued: 09/14/1999
  • Est. Priority Date: 08/02/1995
  • Status: Expired due to Term
First Claim
Patent Images

1. A solid-state image sensing apparatus comprising:

  • a package having a through hole therein, openings on both end faces thereof, and different opening areas of said openings,a lead frame comprising inner leads and outer leads, said lead frame being sealed in said package, anda solid-state image sensing device mounted in said package by being inserted from an inlet of said opening which has a wider area, and thereby sealing said through hole, said solid-state image sensing device being secured to said package via an adhesive.

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