Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same

• US 5,953,589 A
• Filed: 08/20/1997
• Issued: 09/14/1999
• Est. Priority Date: 12/30/1996
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated, ANAM Semiconductor Incorporated (DB HiTek Co., Ltd.)
• Inventors: Darreaux, Robert Francis, Shim, Il Kwon, Heo, Young Wook
• Primary Examiner(s): Picardat, Kevin M.
• Assistant Examiner(s): COLLINS, DEVEN M
• Application Number:
  US08/915,077
• Time in Patent Office: 755 Days
• Field of Search: 438/106, 438/107, 438/108
• US Class Current: 438/106
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/484 Connecting portions
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48699 Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/4985 : Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0695 : Polyamide
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15173 : in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15724 : Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/1579 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

A ball grid array semiconductor package using a flexible circuit board, in which the flexible circuit board has no conductive via hole nor solder mask while having a thin structure formed at only one surface thereof with a circuit pattern having a small length. The flexible circuit board is mounted with a metallic carrier frame to achieve an easy handling thereof, a reduction in the inductance, impedance and coupling effect of adjacent circuit patterns and an easy discharge of heat from a semiconductor chip, thereby achieving an improvement in electrical performance and an improvement in heat discharge performance. The metallic carrier frame has a plurality of openings adapted to increase the bonding force between an encapsulate and constituting elements of the package, thereby removing a bending phenomenon of the package, and a method for fabricating such a BGA semiconductor package. The invention also provides a method for fabricating such a BGA semiconductor package.

Claims

1. A method of fabricating a ball grid array semiconductor package comprising:

forming a flexible circuit board from a thin, flexible film, the circuit board having an upper surface, a lower surface, a circuit pattern formed on the upper surface, a plurality of solder ball lands disposed on the lower surface, and a plurality of apertures extending through the film between the circuit pattern and the solder ball lands;

forming a carrier frame comprising an outer support plate having a window therein;

bonding the carrier frame to the upper surface of the flexible circuit board such that the circuit pattern is framed within the window of the outer support plate, and such that the outer support plate supports and stiffens the flexible circuit board;

bonding a semiconductor chip to the flexible circuit board inside the window of the outer support plate using adhesive means;

wire-bonding the semiconductor chip to the circuit pattern of the flexible circuit board by conductive wires;

encapsulating the semiconductor chip and the conductive wires with an encapsulant to protect them from the environment; and

fusing a plurality of solder balls to the solder ball lands on the lower surface of the flexible circuit board such that the solder balls connect through the apertures to the circuit pattern on the upper surface thereof and function as input/output means for the package.

2. The method of claim 1, further comprising cutting the outer support plate of the carrier frame away from the package so that a portion of the flexible circuit board disposed beneath the outer support plate remains extending beyond the edges of the encapsulant.

3. The method of claim 1, further comprising cutting the outer support plate of the carrier frame and a portion of the flexible circuit board disposed beneath the outer support plate away from the package.

4. The method of claim 1, wherein the flexible circuit board is formed from a film of polyimide resin.

5. The method of claim 1, wherein the flexible circuit board is formed to have a thickness of from about 20 microns to about 150 microns.

6. The method of claim 1, wherein the circuit pattern on the flexible circuit board is formed of a layer of at least one of copper, nickel and gold.

7. The method of claim 1, wherein the carrier frame comprises a metal.

8. The method of claim 7, wherein the carrier frame is formed from at least one of copper, a copper alloy, aluminum and stainless steel.

9. The method of claim 1, wherein:

forming the carrier plate further comprises forming a heat discharge plate within the window of the outer support plate;

bonding the carrier frame to the upper surface of the flexible circuit board further comprises bonding a lower surface of the heat discharge plate to the upper surface of the circuit board; and

,

bonding the semiconductor chip to the flexible circuit board further comprises bonding the semiconductor chip to an upper surface of the heat discharge plate.

10. The method of claim 9, further comprising forming a tie bar connecting the heat discharge plate to the outer support plate.

11. The method of claim 1, further comprising plating at least one of silver and palladium onto portions of the carrier frame for ground-bonding of conductive wires thereto.

12. The method of claim 9, further comprising plating at least one of silver and palladium onto portions of the heat discharge plate for ground-bonding of conductive wires thereto.

13. The method of claim 10, further comprising plating at least one of gold and silver onto the tie bar and a portion of the outer support plate adjacent to the tie bar to form a molding gate thereon.

14. The method of claim 1, wherein:

forming the carrier plate further comprises forming an opening in a portion of the outer support plate between the central window and an outside edge of the plate; and

,

encapsulating the semiconductor chip and the conductive wires further comprises encapsulating the portion of the outer support plate containing the opening such that the bond area between the encapsulant, the support plate, and the circuit board is increased, thereby increasing the strength of the bond.

15. The method of claim 14, wherein the opening is formed in the shape of a slot or a wave.

16. The method of claim 9, further comprising forming an opening in the outer support plate adjacent to the heat discharge plate to enable a wire bond to be made between the semiconductor chip and the circuit board.

17. The method of claim 1, further comprising treating the surface of the carrier frame to increase the strength of its bond with the encapsulant.

18. The method of claim 1, wherein the carrier plate is formed by etching or die stamping.

19. The method of claim 1, wherein at least one of the carrier frame and the semiconductor chip are bonded to the flexible circuit board by means of a polyimide tape or an epoxy.

20. The method of claim 3, wherein a plurality of ball grid array semiconductor packages are simultaneously fabricated in the form of a strip of connected packages, and wherein cutting the outer support plate of the carrier frame away from the completed package further comprises simultaneously cutting the strip of connected packages into individual units.