Process for forming a semiconductor device

  • US 5,961,373 A
  • Filed: 06/16/1997
  • Issued: 10/05/1999
  • Est. Priority Date: 06/16/1997
  • Status: Expired due to Term
First Claim
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1. A process for forming a semiconductor device comprising the steps of:

  • placing a substrate onto a polishing pad within an apparatus, wherein a layer overlies the substrate;

    polishing the layer and conditioning the polishing pad using a first conditioner during a first time period;

    polishing the layer without conditioning the polishing pad using the first conditioner for a second time period after the first time period and before depositing an additional layer; and

    removing the substrate from the apparatus after the steps of polishing.

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