Semiconductor device having multiple overlapping rows of bond pads with conductive interconnects and method of pad placement

  • US 5,962,926 A
  • Filed: 09/30/1997
  • Issued: 10/05/1999
  • Est. Priority Date: 09/30/1997
  • Status: Expired due to Term
First Claim
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1. A semiconductor device comprising:

  • a die having four sides;

    a first side of the die having;

    a first row of bond pads positioned substantially along a first axis offset from and parallel to the first side of the die by a first distance;

    a second row of bond pads positioned substantially along a second axis offset from and parallel to the first side of the die by a second distance which is greater than the first distance;

    whereineach bond pad of the first row has a first and a second side substantially perpendicular to the first side of the die.each bond pad of the second row has a first and a second side substantially perpendicular to the first side of the die, the first side of each bond pad of the second row forming a pad placement axes,each pad placement axes intersecting a corresponding bond pad associated with the first row of bond pads where the pad placement axes is not coincident with the first or second side of the corresponding bond pad.

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