Method of attaching a chip to a flexible substrate

• US 5,969,418 A
• Filed: 12/22/1997
• Issued: 10/19/1999
• Est. Priority Date: 12/22/1997
• Status: Expired due to Fees

• Current Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Original Assignee: Ford Motor Company
• Inventors: Belanger, Thomas Dudley Jr.
• Primary Examiner(s): Saadat, Mahshid
• Assistant Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US08/996,352
• Time in Patent Office: 666 Days
• Field of Search: 257/737, 257/738, 257/778, 257/784, 257/701, 228/180.22, 438/613
• US Class Current: 257/737
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/81141 Guiding structures both on and outside the body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/81898 Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/0105 Tin [Sn]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence

Abstract

There is disclosed herein an electronic circuit, one embodiment of which comprises: an electronic component 10 having bump terminations 12 on a first surface 14 thereof; a flexible substrate 16 having a plurality of generally round holes 18 therein arranged in correspondence with the bump terminations, wherein each hole has a diameter d smaller than the diameter D of a corresponding bump termination; and an array of conductive circuit traces 20 arranged on a second surface 22 of the substrate, wherein each of the circuit traces terminates generally about one of the holes in the substrate. Each bump termination 12 is fixably inserted into its corresponding substrate hole 18 so as to mechanically connect the electronic component 10 with the substrate 16 and to electrically connect each termination 12 with a corresponding circuit trace 20.

Claims

1. An electronic circuit, comprising:

an electronic component having bump terminations on a first surface thereof;

a flexible substrate having a plurality of generally round holes therein arranged in correspondence with said bump terminations, wherein each of said holes is defined by a hole periphery of said substrate immediately about each hole, wherein each hole has a diameter d smaller than a largest diameter D of a corresponding bump termination; and

an array of conductive circuit traces arranged on a second surface of said substrate, wherein each of said circuit traces terminates proximate one of the holes in said substrate;

each bump terminator being fixably inserted into its corresponding hole in said substrate so as to stretch its corresponding hole periphery and enlarge said corresponding hole, thereby providing a compressive gripping force exerted by each stretched hole periphery on its corresponding bump termination, so as to mechanically connect said electronic component with said substrate and to electrically connect each termination with a corresponding circuit trace.

2. An electronic circuit according to claim 1, wherein said bump terminations are formed by ball bumping.

3. An electronic circuit according to claim 1, wherein said bump terminations have an average bump height and wherein said substrate has a thickness between 20% and 50% of the average bump height inclusive.

4. An electronic circuit according to claim 1, further comprising a compliant layer of electrically insulative adhesive-surfaced material interposed between and in contact with said first surface of said electronic component and a mating surface of said substrate.

5. An electronic circuit according to claim 1, wherein said flexible substrate is formed from a material selected from the group consisting of polyimide, polyester, epoxy composite, aramid, polyethylene, polyethylene terephthalate, polyethylene naphthalate, polyetherimide, polyvinyl difluoride, and fluorinated ethylene-propylene copolymer.

6. An electronic circuit according to claim 1, wherein each bump termination has a bulbous profile having:

a neck portion attached to said substrate and having a diameter d_N ; and

an end portion distal from said substrate and having said diameter D;

wherein D>

d_N >

d.

7. An electronic circuit according to claim 1, wherein said second surface of said substrate is a mating surface facing toward said first surface of said electronic component.

8. An electronic circuit according to claim 1, wherein said second surface of said substrate is an outer surface facing away from said first surface of said electronic component.

9. An electronic circuit according to claim 1, wherein at least an outer portion of each bump termination is made of gold.

10. An electronic circuit according to claim 1, wherein each hole in said substrate is substantially circular.

11. An electronic circuit according to claim 4, wherein said compliant layer comprises an adhesive-surfaced foam tape.

12. An electronic circuit according to claim 7, wherein said substrate is oriented substantially parallel with said first surface of said electronic component, and wherein said hole periphery of said substrate immediately about each hole is flared outward away from said first surface.

13. An electronic circuit according to claim 8, wherein said substrate is oriented substantially parallel with said first surface of said electronic component, and wherein a hole periphery of said substrate immediately about each hole is generally not flared with respect to said first surface.

14. An electronic circuit according to claim 8, wherein said substrate is oriented substantially parallel with said first surface of said electronic component, and wherein a hole periphery of said substrate immediately about each hole is flared generally inward toward said first surface.

15. An electronic circuit according to claim 9, wherein at least a portion of each circuit trace adjacent each hole in said substrate is made of gold.

16. An electronic circuit, comprising:

an electronic component having bump terminations on a first surface thereof,

a flexible substrate having a plurality of generally round holes therein arranged in correspondence with said bump terminations, wherein each of said holes is defined by a hole periphery of said substrate immediately about each hole, wherein each hole has a diameter d smaller than a largest diameter D of a corresponding bump termination; and

an array of conductive circuit traces arranged on a second surface of said substrate, wherein each of said circuit traces terminates proximate one of the holes in said substrate;

wherein each bump termination has a substantially bulbous profile having;

a neck portion attached to said substrate and having a diameter d_N, and

an end portion distal from said substrate and having a diameter D,

wherein D>

d_N >

d;

each bump termination being fixably inserted into its corresponding hole in said substrate so as to stretch its corresponding hole periphery and enlarge said corresponding hole, thereby providing a compressive gripping force exerted by each stretched hole periphery on its corresponding bump termination, so as to mechanically connect said electronic component with said substrate and to electrically connect each termination with a corresponding circuit trace.

17. An electronic circuit according to claim 16, wherein said bump terminations have an average bump height and wherein said substrate has a thickness between 20% and 50% of the average bump height inclusive.

18. An electronic circuit according to claim 16, further comprising a compliant layer of electrically insulative adhesive-surfaced material interposed between and in contact with said first surface of said electronic component and a mating surface of said substrate.

19. An electronic circuit according to claim 16, wherein said second surface of said substrate is a mating surface facing toward said first surface of said electronic component, and wherein said substrate is oriented substantially parallel with said first surface of said electronic component, and wherein said hole periphery of said substrate immediately about each hole is flared generally outward away from said first surface.

20. An electronic circuit, comprising:

an electronic component having bump terminations on a first surface thereof;

a flexible substrate having a plurality of generally round holes therein arranged in correspondence with said bump terminations, wherein each of said holes is defined by a hole periphery of said substrate immediately about each hole, wherein each hole has a diameter d smaller than a largest diameter D of a corresponding bump termination; and

an array of conductive circuit traces arranged on a second surface of said substrate, wherein each of said circuit traces terminates proximate one of the holes in said substrate;

wherein each bump termination has a substantially bulbous profile having;

a neck portion attached to said substrate and having a diameter d_N, and

an end portion distal form said substrate and having a diameter D,

wherein D>

d_N >

d;

wherein said bump terminations have an average bump height and wherein said substrate has a thickness between 20% and 50% of the average bump height, inclusive;

each bump termination being fixably inserted into its corresponding hole in said substrate so as to stretch its corresponding hole periphery and enlarge said corresponding hole, thereby providing a compressive gripping force exerted by each stretched hole periphery on its corresponding bump termination, so as to mechanically connect said electronic component with said substrate and to electrically connect each termination with a corresponding circuit trace.