Electronic component, method for making the same, and lead frame and mold assembly for use therein

• US 5,977,613 A
• Filed: 03/04/1997
• Issued: 11/02/1999
• Est. Priority Date: 02/28/1997
• Status: Expired due to Term

• Current Assignee: Collabo Innovations, Inc. (Wi-LAN Inc.)
• Original Assignee: Matsushita Electric Corporation (Panasonic Holdings Corporation)
• Inventors: Takata, Hirofumi, Tanida, Tadashi
• Primary Examiner(s): Arroyo, Teresa M.
• Assistant Examiner(s): POTTER, ROY KARL
• Application Number:
  US08/811,606
• Time in Patent Office: 973 Days
• Field of Search: 257/692, 257/666, 257/787, 257/676
• US Class Current: 257/666
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10161 : with a rectangular active surface
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18301 : being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
• CPC Class Codes: H05K 3/3426 : characterised by the leads

Abstract

A lead has a thick part having a thickness of 0.2 mm and a thin part having a thickness of 0.1 mm. The thin part is formed having a greater width than the thick part for preventing the lead from slipping from a resin. A semiconductor chip is fixed on the thin part using a conductive adhesive. A lateral surface of the thick part and a lateral surface of the resin are simultaneously formed by a single cut so that the thick part'"'"'s lateral surface is located at a lower end area of the resin'"'"'s lateral surface and these surfaces are exposed forming the same plane. A bottom surface of the thick part projects by from 0.03 mm to 0.05 mm from the resin bottom surface to meet lead stand-off specifications. Thick parts of other leads electrically connected with electrodes on the semiconductor chip with Au wires, are likewise exposed at the resin lateral surface and project from the resin bottom surface. Such arrangements realize high density mounting of electronic components onto a printed board.

Claims

1. An electronic component of a resin molded package type, said electronic component comprising:

(a) an electronic element;

(b) a lead which is electrically connected with said electronic element, said lead having a thin part and having a thick part which is formed to provide a step on a bottom surface of said lead; and

(c) a resin which encapsulates said electronic element and said lead;

wherein a lateral surface of said thick part is exposed at a lower end area of a lateral surface of said resin.

2. The electronic component of claim 1, wherein said lead is formed of a soft material which cuts easily.

3. The electronic component of claim 1, wherein said exposed lateral surface of said thick part is plated.

4. The electronic component of claim 1, wherein a bottom surface of said thick part is exposed at a bottom surface of said resin.

5. The electronic component of claim 4, wherein plating is applied only to said exposed bottom surface of said thick part.

6. The electronic component of claim 4, wherein said exposed bottom surface of said thick part is continuous with said exposed lateral surface of said thick part.

7. The electronic component of claim 6, wherein said exposed bottom surface and exposed lateral surface of said thick part are plated.

8. The electronic component of claim 4, wherein said exposed bottom surface of said thick part slightly projects from said bottom surface of said resin.

9. The electronic component of claim 4, wherein said bottom surface of said resin has, around said exposed bottom surface of said thick part, portions defining grooves.

10. The electronic component of claim 1, wherein said resin has a top surface the periphery of which is provided with either a chamfer or a step.

11. The electronic component of claim 1, wherein at least a portion of each of four lateral surfaces of said resin is formed by cutting.

12. The electronic component of claim 1, wherein said lateral surface of said resin has a cut surface formed at the time of cutting said lead and a non-cut surface formed at the time of performing said encapsulation process.

13. The electronic component of claim 12, wherein said cut surface of said resin'"'"'s lateral surface is perpendicular to said resin'"'"'s bottom surface and wherein said non-cut surface of said resin'"'"'s lateral surface tilts with respect to said resin'"'"'s bottom surface.

14. The electronic component of claim 12, wherein said cut surface of said resin'"'"'s lateral surface is formed, being perpendicular with respect to said resin'"'"'s bottom surface at a lower end area of said resin'"'"'s lateral surface.

15. The electronic component of claim 12, wherein each of lower end areas of four lateral surfaces of said resin is formed by cutting, being perpendicular with respect to said bottom surface of said resin.

16. The electronic component of claim 4, wherein said exposed bottom surface of said thick part projects, from said bottom surface of said resin, by a length less than a difference in thickness between said thin part and said thick part.

17. The electronic component of claim 1, wherein said thin part is greater in top surface width than said thick part.

18. The electronic component of claim 1, wherein said thin part has a top surface whose area is greater than the area of said electronic element and wherein said electronic element is fixed onto said thin part.

19. The electronic component of claim 1, wherein said thin part is provided with a notch, said notch acting as a prevention means for preventing said lead from slipping from said resin.

20. A plate-like lead frame for use in fabrication of an electronic component of a resin molded package type, said lead frame comprising:

(a) a rectangular exterior frame;

(b) a plurality of bridge parts which are formed into a lattice so as to establish connections between a pair of opposite sides of said rectangular exterior frame as well as between another pair of opposite sides thereof; and

(c) a plurality of sets of lead parts which extend towards respective lattice open spaces which are horizontally and perpendicularly, and two-dimensionally defined by said bridge parts.

21. The lead frame of claim 20, each said lead part comprising:

(a) a base end having the same thickness as said exterior frame and said bridge part; and

(b) a leading end which is formed, having a width greater than the width of said base end and having a thickness smaller than the thickness of said base end so as to form a step on the side of a bottom surface thereof.

22. The lead frame of claim 21, wherein a specific lead part of said plurality of sets of lead parts is provided with a leading end whose top surface area is greater than the area of an electronic element that is fixed thereon.

23. The lead frame of claim 21, wherein a specific lead part of said plurality of sets of lead parts is provided with a notch that is a prevention against lead slipping from a resin after a resin molding is performed.

24. The lead frame of claim 20, wherein said rectangular exterior frame has at four corners thereof portions defining holes for positioning which are used in performing a resin molding process as well as in cutting said plurality of sets of lead parts.

25. The lead frame of claim 20, wherein said rectangular exterior frame has at one side thereof portions defining a plurality of feed holes.

26. A mold assembly for use in fabrication of an electronic component of a resin molded package type, said mold assembly comprising:

(a) a lower mold element onto which a lead frame with a plurality of electronic elements which are arranged horizontally and perpendicularly, and two-dimensionally is placed;

(b) an upper mold element that defines a plurality of cavities which are horizontally and perpendicularly, and two-dimensionally arranged correspondingly to said plurality of electronic elements and which are communicated with one another at least in one direction; and

(c) common gates through which a resin is injected into said plurality of cavities.

27. The mold assembly of claim 26, wherein said plurality of cavities are communicated with one another via open spaces having the same height as said cavities.

28. The mold assembly of claim 26, wherein said upper mold element is provided with a plurality of recesses, each of said recesses having a depth capable of forming most of each said cavity.

29. The mold assembly of claim 26, wherein at least one of said upper and lower mold elements is provided with pins which are inserted into holes for positioning formed in an exterior frame of said lead frame.