Electronic component, method for making the same, and lead frame and mold assembly for use therein

  • US 5,977,613 A
  • Filed: 03/04/1997
  • Issued: 11/02/1999
  • Est. Priority Date: 02/28/1997
  • Status: Expired due to Term
First Claim
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1. An electronic component of a resin molded package type, said electronic component comprising:

  • (a) an electronic element;

    (b) a lead which is electrically connected with said electronic element, said lead having a thin part and having a thick part which is formed to provide a step on a bottom surface of said lead; and

    (c) a resin which encapsulates said electronic element and said lead;

    wherein a lateral surface of said thick part is exposed at a lower end area of a lateral surface of said resin.

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