Controlled cleavage process and device for patterned films

  • US 5,985,742 A
  • Filed: 02/19/1998
  • Issued: 11/16/1999
  • Est. Priority Date: 05/12/1997
  • Status: Expired due to Term
First Claim
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1. A process for forming a film of material comprising devices, said process comprising steps of:

  • introducing particles in a selected manner through a surface of a substrate to a selected depth underneath said surface, said particles being at a concentration at said selected depth to define a substrate material to be removed above said selected depth; and

    providing energy to a selected region of said substrate to initiate a controlled cleaving action at said selected depth in said substrate, whereupon said cleaving action is made using a propagating cleave front to free a portion of said material to be removed from said substrate;

    wherein said substrate material to be removed comprise a plurality of devices therein.

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