Fabricating interconnects and tips using sacrificial substrates

  • US 5,994,152 A
  • Filed: 01/24/1997
  • Issued: 11/30/1999
  • Est. Priority Date: 02/21/1996
  • Status: Expired due to Term
First Claim
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1. A method of an fabricating interconnection element, comprising:

  • fabricating an interconnection component, including a connection region,fabricating a cantilever structure on a sacrificial substrate;

    mounting the cantilever structure to the connection region of the interconnection component; and

    releasing the cantilever structure from the sacrificial substrate by removing at least a portion of the sacrificial substrate.

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