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Two dimensional thermoelectric cooler configuration

  • US 6,000,225 A
  • Filed: 04/27/1998
  • Issued: 12/14/1999
  • Est. Priority Date: 04/27/1998
  • Status: Expired due to Term
First Claim
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1. A system for efficiently transferring heat from a thermal source to a thermal sink utilizing thermoelectric cooling effects, said system comprising:

  • a power source;

    a hot source on an integrated circuit having a surface area;

    a cold sink on said integrated circuit having a surface area;

    a plurality of thermoelectric elements on said integrated circuit electrically coupled in a series configuration with said power source and thermally coupled in a parallel configuration with said surface area of said cold sink and said surface area of said hot source, wherein said surface area of said hot source is greater than said surface area of said cold sink;

    a thermal switch coupling said thermoelectric elements to said cold sink; and

    means for intermittently pulsing said thermal switch such that a net thermoelectric energy transfer flows into said cold sink.

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