Dual purpose retaining ring and polishing pad conditioner

  • US 6,004,193 A
  • Filed: 07/17/1997
  • Issued: 12/21/1999
  • Est. Priority Date: 07/17/1997
  • Status: Expired due to Term
First Claim
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1. An apparatus for retaining a semiconductor wafer against a polishing pad, the apparatus comprising:

  • a retaining ring having an inner surface for retaining the wafer while polishing and having an outer surface and comprising an orthogonal surface arranged substantially perpendicular to the inner surface;

    said inner surface defines an opening adapted for receiving the semiconductor wafer and a wafer carrier; and

    said orthogonal surface comprises an abrasive material extending along the orthogonal surface said wafer carrier is configured to hold said semiconductor wafer, wherein said wafer carrier is movable within said opening.

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