Reflow soldering method
First Claim
1. A method for assembling a circuit card assembly from a circuit card having a primary and a secondary side, the primary side having primary component pads and primary connector pads, the secondary side having secondary connector pads, the method comprising:
- (a) applying solder paste to the primary component pads, primary connector pads, and secondary connector pads, the solder paste including solder that is nonliquidus;
(b) placing components having component leads on the primary connector pads, wherein the component leads contact the solder paste that has been applied to the primary component pads;
(c) heating together in an oven the circuit card and a connector having a primary row of nonvertically approaching leads and a secondary row of nonvertically approaching leads; and
(d) mating connector with the circuit card when the solder is liquidus, whereby the primary row of nonvertically approaching leads engages liquidus solder on the primary connector pads and the row of secondary nonvertically approaching leads engages liquidus solder on the secondary connector pads.
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0 Petitions
Accused Products
Abstract
With the present invention, a reflow soldering method is provided for soldering a nonvertically approaching lead, which is part of a nonvertically approaching device (e.g, an edge connector), to a corresponding soldering surface (e.g., a pad on a circuit card) that includes solder. The soldering surface and solder are heated in an oven to melt the solder. While the solder is liquids, the nonvertically approaching lead is mated with the soldering surface as it is inserted into the solder. The soldering surface, solder, and nonvertically approaching lead are then cooled, and the solder solidifies to conductively mount the nonvertically approaching lead to the soldering surface.
69 Citations
34 Claims
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1. A method for assembling a circuit card assembly from a circuit card having a primary and a secondary side, the primary side having primary component pads and primary connector pads, the secondary side having secondary connector pads, the method comprising:
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(a) applying solder paste to the primary component pads, primary connector pads, and secondary connector pads, the solder paste including solder that is nonliquidus; (b) placing components having component leads on the primary connector pads, wherein the component leads contact the solder paste that has been applied to the primary component pads; (c) heating together in an oven the circuit card and a connector having a primary row of nonvertically approaching leads and a secondary row of nonvertically approaching leads; and (d) mating connector with the circuit card when the solder is liquidus, whereby the primary row of nonvertically approaching leads engages liquidus solder on the primary connector pads and the row of secondary nonvertically approaching leads engages liquidus solder on the secondary connector pads.
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2. A method for soldering a nonvertically approaching lead to a corresponding soldering surface, the method comprising:
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(a) heating in an oven a soldering surface with solder to melt the solder; (b) mating the nonvertically approaching lead to the soldering surface while the solder is melted; and (c) cooling the solder to conductively and mechanically adhere the nonvertically approaching lead to the soldering surface. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method for assembling a circuit card assembly from a circuit card having a primary and a secondary side, the primary side having primary component pads and primary connector pads, the secondary side having secondary connector pads, the method comprising:
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(a) applying solder paste to the primary component and connector pads, the solder paste including solder that is nonliquidus; (b) placing components having component leads on the primary connector pads, wherein the component leads contact the solder paste that has been applied to the primary component pads; (c) heating the circuit card in an oven to reflow the solder, whereby solid solder beads are formed on the primary connector pads; (d) applying solder paste to the secondary connector pads, the solder paste including solder that is nonliquidus; (e) heating together in an oven the circuit card and a connector having a primary row of nonvertically approaching leads and a secondary row of nonvertically approaching leads; and (f) mating the connector with the circuit card when the solder on both the primary and secondary connector pads is liquidus, whereby the primary row of nonvertically approaching leads engages liquidus solder on the primary connector pads and the row of secondary nonvertically approaching leads engages liquidus solder on the secondary connector pads. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A method for mounting a device to a circuit card having at least one pad that contains solder that is non-liquidus, the device having at least one nonvertically approaching lead to be soldered to the at least one pad, the method comprising:
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(a) heating in an oven the solder; (b) mating the device with the circuit card while the solder is liquidus, whereby the at least one nonvertically approaching lead encounters liquidus solder; and (c) cooling the solder to conductively and mechanically adhere the at least one nonvertically approaching lead with the at least one pad to operably mount the device to the circuit card. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification