Process depending on plasma discharges sustained by inductive coupling

CAFC
  • US 6,017,221 A
  • Filed: 05/30/1997
  • Issued: 01/25/2000
  • Est. Priority Date: 10/28/1996
  • Status: Expired due to Term
First Claim
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1. A process for fabricating a product using a plasma source, said process comprising the steps of subjecting a substrate to entities, at least one of said entities emanating from a gaseous discharge excited by a high frequency field from an inductive coupling structure in which a phase portion and an anti-phase portion of capacitive currents coupled from the inductive coupling structure are selectively balanced;

  • wherein said inductive coupling structure is adjusted using a wave adjustment circuit, said wave adjustment circuit adjusting the phase portion and the anti-phase portion of the capacitively coupled currents.

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