Production of electrodes for electrochemical sensing

• US 6,020,110 A
• Filed: 01/27/1997
• Issued: 02/01/2000
• Est. Priority Date: 06/24/1994
• Status: Expired due to Fees

• Current Assignee: Environmental Sensors Limited
• Original Assignee: Cambridge Sensors Limited
• Inventors: Williams, Stephen Charles, Arnold, Peter Thomas, Yon-Hin, Bernadette
• Primary Examiner(s): Duda, Kathleen
• Application Number:
  US08/765,565
• Time in Patent Office: 1,100 Days
• Field of Search: 430/311, 430/315
• US Class Current: 430/315
• CPC Class Codes: G01N 27/403 Cells and electrode assemblies

Abstract

A method for the production of electrodes, especially microelectrodes, in which the (micro) electrode consists essentially of an electrically-insulating material through which apertures are formed to reveal the electrically-conducting material, is characterized in that aperture as formed by the use of a light-hardened (photopolymerizing) resist or light-softened (photoinduced breaking of bonds) resist.

Claims

1. A method for producing a microelectrode, which comprises depositing an electrically-conducting layer on a non-conducting polymeric plastic substrate by thick film printing;

applying on the conducting layer an electrically-insulating layer of photoimageable dielectric material; and

forming in the insulating layer, before or after application of the insulating layer onto the conducting layer, an array of apertures that expose the conducting layer, the apertures being formed by image-wise exposing the electrically-insulating layer of dielectric material to render parts of the insulating layer removable, followed by developing with a developer solution to remove said parts to form the array of apertures.

2. A method according to claim 1, wherein the dielectric material is exposed image-wise to render parts of the dielectric material removable, and said parts of the dielectric layer are removed by a developer, to form the array after application of the insulating layer on the conducting layer.

3. A method according to claim 1, wherein the dielectric material is photoimaged to produce the array of apertures, prior to bonding of the dielectric material to the conducting layer.

4. A method according to claim 1, wherein the apertures are of uniform size and shape, and are regularly-spaced, their diameters being 10 to 75 μ

m.

5. A method according to claim 1, wherein the apertures are regularly spaced, 2 to 10 aperture diameters apart.

6. A method according to claim 1, which additionally comprises deposition of a metal species to the exposed conducting layer.

7. A method according to claim 6, wherein the metal species is selected from the group consisting of gold, mercury and platinum.

8. A method according to claim 1, which additionally comprises bonding or adsorption of proteins, nucleic acids, small molecules or conducting polymers to the exposed conducting layer.

9. A method for producing a microelectrode, which method comprises:

(a) providing a non-conducting polymeric plastic substrate;

(b) depositing on said plastic substrate an electrically-conducting layer;

(c) applying on the electrically-conducting layer an electrically insulating photoimageable resist layer, and

(d) before or after application of the electrically insulating layer on the electrically-conducting layer, forming an array of apertures in the electrically insulating photoimageable resist layer, for exposing the electrically-conducting layer on the plastic substrate, by image-wise exposure of said resist layer to a light source through a patterned mask to render portions of said resist layer removable by a developer and thereafter contacting the resist layer with developer to remove said removable portions of the resist layer.