Pressure transducer with error compensation from cross-coupling outputs of two sensors

• US 6,023,978 A
• Filed: 07/10/1997
• Issued: 02/15/2000
• Est. Priority Date: 07/10/1996
• Status: Expired due to Term

• Current Assignee: Honeywell Data Instruments Incorporated (Honeywell International Inc.)
• Original Assignee: Honeywell Data Instruments Incorporated (Honeywell International Inc.)
• Inventors: Breitenbach, Alexander, Dauenhauer, Dale, Erichsen, Herman, Dauenhauer, Dennis
• Primary Examiner(s): FELBER, JOSEPH LEON
• Application Number:
  US08/891,046
• Time in Patent Office: 950 Days
• Field of Search: 73/720, 73/721, 73/719, 338/42, 338/4
• US Class Current: 73/720
• CPC Class Codes: G01L 13/02 using elastically-deformable members or pistons as sensing elements
• CPC Class Codes: G01L 13/025 using diaphragms
• CPC Class Codes: G01L 15/00 Devices or apparatus for measuring two or more fluid pressure values simultaneously
• CPC Class Codes: G01L 19/0038 being part of the housing other details about the housing G01L19/14
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/14 Housings G01L19/0007, G01L19/0084, G01L19/0092, G01L19/04, G01L19/06 take precedence
• CPC Class Codes: G01L 19/142 Multiple part housings
• CPC Class Codes: G01L 19/148 Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
• CPC Class Codes: G01L 9/045 with electric temperature compensating means non electric temperature compensating means G01L19/04
• CPC Class Codes: G01L 9/065 with temperature compensating means non electric temperature compensating means G01L19/04

Abstract

A pressure transducer that includes at least two sensors having substantially similar or substantially identical error characteristics, wherein each sensor is arranged to be subjected to an applied pressure and the outputs of the sensors are electrically coupled so that errors associated with one sensor are compensated by errors associated with the other sensor. The sensors may be substantially identical silicon sensors formed in close proximity on the same wafer.

Claims

1. A pressure transducer comprising:

a first sensor; and

a second sensor;

the first and second sensors having substantially similar error characteristics, each of the first and second sensors being arranged to be subjected to at least one of a first pressure and a second pressure and to provide an output indicative of the pressure exerted thereon, the outputs of the sensors being electrically cross-coupled to each other so that an error in the first sensor is compensated with a substantially similar error in the second sensor.

2. The pressure transducer recited in claim 1, wherein the sensors have substantially identical error characteristics.

3. The pressure transducer recited in claim 1, wherein each sensor is a silicon sensor.

4. The pressure transducer recited in claim 1, wherein each of the first and second sensors includes a first pressure receiving surface and a second pressure receiving surface that are adapted to be subjected to the first and second pressures, the first and second pressure receiving surfaces of the first sensor corresponding to the first and second pressure receiving surfaces of the second sensor, the sensors being arranged so that the first pressure receiving surface of the first sensor and the second pressure receiving surface of the second sensor are to be subjected to the first pressure.

5. The pressure transducer recited in claim 4, wherein the first pressure receiving surface of the first sensor is fluidly coupled to the second pressure receiving surface of the second sensor.

6. The pressure transducer recited in claim 4, wherein the second pressure receiving surface of the first sensor and the first pressure receiving surface of the second sensor are to be subjected to the second pressure.

7. The pressure transducer recited in claim 6, wherein the second pressure receiving surface of the first sensor is fluidly coupled to the receiving surface of the second sensor.

8. The pressure transducer recited in claim 4, wherein the first pressure receiving surface is free of electronic circuitry and the second pressure receiving surface includes electronic circuitry.

9. The pressure transducer recited in claim 1, wherein each of the first and second sensors includes a first pressure receiving surface and a second pressure receiving surface that are adapted to be subjected to the first and second pressures, the first and second pressure receiving surfaces of the first sensor corresponding to the first and second pressure receiving surfaces of the second sensor, the sensors being arranged so that each of the first pressure receiving surface of the first sensor, the second pressure receiving surface of the first sensor and the first pressure receiving surface of the second sensor is to be subjected to the second pressure.

10. The pressure transducer recited in claim 9, wherein the first pressure receiving surface of the first sensor is fluidly coupled to the receiving surface of the second sensor.

11. The pressure transducer recited in claim 9, wherein the first pressure receiving surface is free of electronic circuitry and the second pressure receiving surface includes electronic circuitry.

12. The pressure transducer recited in claim 9, wherein the second pressure receiving surface is free of electronic circuitry and the first pressure receiving surface includes electronic circuitry.

13. The pressure transducer recited in claim 1, wherein each of the first and second sensors includes a first pressure receiving surface and a second pressure receiving surface that are adapted to be subjected to a pressure, the first and second pressure receiving surfaces of the first sensor corresponding to the first and second pressure receiving surfaces of the second sensor, the first pressure receiving surface of the first sensor to be subjected to the first pressure, the second pressure receiving surface of the second sensor to be subjected to the second pressure, the second pressure receiving surface of the first sensor and the first pressure receiving surface of the second sensor to be subjected to a third pressure.

14. The pressure transducer recited in claim 13, wherein the second pressure receiving surface of the first sensor is fluidly coupled to the first pressure receiving surface of the second sensor.

15. The pressure transducer recited in claim 13, wherein the first pressure receiving surface is free of electronic circuitry and the second pressure receiving surface includes electronic circuitry.

16. The pressure transducer recited in claim 1, wherein the first and second sensors include wheatstone bridges.

17. A pressure transducer comprising:

a first base member;

a second base member;

a first sensor and a second sensor having substantially similar error characteristics, the first sensor being disposed on the first base member and the second sensor being disposed on the second base member;

an interface member disposed between the first base member and the second base member to define a first cavity about the first sensor; and

a cover disposed on the second base member to define a second cavity about the second sensor;

the first and second sensors being fluidly and electrically coupled so that an error in the first sensor is compensated with a substantially similar error in the second sensor.

18. The pressure transducer recited in claim 17, wherein the sensors have substantially identical error characteristics.

19. The pressure transducer recited in claim 17, wherein each of the first and second base members is an interconnection device.

20. The pressure transducer recited in claim 19, wherein each of the first and second base members is a printed circuit board.

21. The pressure transducer recited in claim 20, wherein each printed circuit board includes electronic circuitry configured to establish electrical interconnections between the first and second sensors.

22. The pressure transducer recited in claim 21, further comprising a plurality of electrical contacts electrically interconnecting the first base member and the second base member.

23. The pressure transducer recited in claim 17, further comprising a plurality of electrical contacts interconnecting the first base member and the second base member.

24. The pressure transducer recited in claim 17, wherein the first and second sensors are substantially identical silicon sensors.

25. The pressure transducer recited in claim 24, wherein each of the first and second sensors includes first and second pressure receiving surfaces, the first and second pressure receiving surfaces of the first sensor corresponding to the first and second pressure receiving surfaces of the second sensor, the interface member fluidly coupling the first pressure receiving surface of the first sensor to the second pressure receiving surface of the second sensor.

26. The pressure transducer recited in claim 24, wherein each of the first and second sensors includes first and second pressure receiving surfaces, the first and second pressure receiving surfaces of the first sensor corresponding to the first and second pressure receiving surfaces of the second sensor, the interface member fluidly coupling the first pressure receiving surface of the first sensor to the first pressure receiving surface of the second sensor.

27. The pressure transducer recited in claim 17, wherein the first and second sensors include wheatstone bridges.

28. The pressure transducer recited in claim 27, wherein the wheatstone bridges have outputs that are electrically cross-coupled.

29. The pressure transducer recited in claim 17, wherein the interface member mechanically couples the first base member and the second base member.

30. The pressure transducer recited in claim 29, wherein the interface member is constructed and arranged to fluidly couple the first sensor to the second sensor.

31. A method of forming a pressure transducer with error compensation, the method comprising steps of:

(a) selecting first and second sensors having substantially similar characteristics, each sensor providing an output indicative of pressure exerted thereon;

(b) fluidly coupling the first and second sensors so that each sensor is arranged to be subjected to a first pressure and a second pressure; and

(c) electrically cross-coupling the outputs of the first and second sensors so that an error in the first sensor is compensated with a substantially similar error in the second sensor.

32. The method recited in claim 31, wherein the first and second sensors are silicon sensors formed on a wafer, and wherein step (a) includes selecting the sensors from the same wafer.

33. The method recited in claim 32, wherein step (a) includes selecting the first and second sensors from sensors formed in close proximity to each other.

34. The method recited in claim 33, wherein step (a) includes selecting the first and second sensors from adjacent sensor die on the wafer.

35. The method recited in claim 31, wherein each of the first and second sensors includes first and second pressure receiving surfaces, the first and second pressure receiving surfaces of the first sensor corresponding to the first and second pressure receiving surfaces of the second sensor, and wherein step (b) includes fluidly coupling the first pressure receiving surface of the first sensor to the second pressure receiving surface of the second sensor.

36. The method recited in claim 35, wherein step (b) further includes fluidly coupling the second pressure receiving surface of the first sensor to the first pressure receiving surface of the second sensor.

37. The method recited in claim 31, wherein each sensor includes a first pressure receiving surface and a second pressure receiving surface, the first and second pressure receiving surfaces of the first sensor corresponding to the first and second pressure receiving surfaces of the second sensor, and wherein step (b) includes fluidly coupling the first pressure receiving surface of the first sensor to the first pressure receiving surface of the second sensor.

38. The method recited in claim 31, wherein step (c) includes subtracting the output signals from each other.

39. The method recited in claim 31, wherein step (a) includes the step of selecting the first and second sensors with substantially identical error characteristics.

40. The method recited in claim 31, wherein step (a) includes the step of testing the first and second sensors and selecting the first and second sensors with similar temperature offset characteristics.