Luggage tag assembly

• US 6,027,027 A
• Filed: 05/31/1997
• Issued: 02/22/2000
• Est. Priority Date: 05/31/1996
• Status: Expired due to Term

• Current Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Smithgall, David Harry
• Primary Examiner(s): Le, Thien Minh
• Application Number:
  US08/866,936
• Time in Patent Office: 997 Days
• Field of Search: 235/488, 235/382, 235/492, 235/486, 235/375, 235/380, 235/382.5
• US Class Current: 235/488
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A low cost radio frequency identification tag is provided for attaching to and identifying objects such as, for example, a passenger'"'"'s luggage. The tag is programmed to contain information such as the origin, destination, and name of a passenger accompanying the luggage. This information is programmed into the tag at the time when the customer checks his or her luggage at a terminal. The tag includes an integrated circuit with all radio and data functions incorporated onto this integrated circuit, and an antenna for radio communication. The integrated circuit in the tag is suitably powered from the incident radio frequency energy provided by a interrogator while the tag is located in the radiation pattern of this interrogator. The luggage tag is assembled inexpensively by packaging the integrated circuit between paper or plastic substrates on which printed identifying information is also added at the point of check-in at the terminal. Also, a wire loop antenna may be placed between the substrates such that it contacts the integrated circuit at two points, for forming a complete electrical circuit.

Claims

1. A method of assembly for a radio frequency identification tag having an integrated circuit and a loop antenna embedded in the tag, the method comprising the steps of:

providing a supply of substrate material;

forming an antenna on the substrate material, said antenna including a first pair of conducting pads;

selectively applying a conductive epoxy onto the substrate material;

positioning the integrated circuit on the substrate material so that a second pair of conducting pads on said integrated circuit are positioned in contact alignment with said first pair of conducting pads for said antenna; and

curing the conducting epoxy for forming an attachment between the first pair of conducting pads on the antenna and the second pair of conducting pads on the integrated circuit.

2. The method of claim 1 wherein the antenna forming step includes the step of fabricating the loop antenna from a thin wire positioned on the substrate material.

3. The method of claim 1 wherein the antenna forming step includes the step of fabricating the loop antenna by printing a conductive ink onto the substrate material.

4. The method of claim 3 wherein the substrate material is paper.

5. The method of claim 3 wherein the substrate material is plastic.

6. The method of claim 1 further including the step of providing in said integrated circuit a radio function and a data function for communicating over said antenna.

7. The method of claim 6 further including the step of receiving operating power for said integrated circuit over said antenna.

8. A method of assembly for a radio frequency identification tag having an integrated circuit and a loop antenna embedded in the tag, the method comprising the steps of:

providing a first supply of a first substrate material;

forming an antenna on the first substrate material, said antenna including a first pair of conducting pads;

selectively applying a conductive epoxy onto the first substrate material;

positioning the integrated circuit on the first substrate material so that a second pair of conducting pads on said integrated circuit are positioned in contact alignment with said first pair of conducting pads for said antenna;

curing the conducting epoxy for forming an attachment between the first pair of conducting pads on the antenna and the second pair of conducting pads on the integrated circuit; and

providing a second supply of a second substrate material for encapsulating said antenna and said integrated circuit between said first substrate material and said second substrate material.

9. The method of claim 8 wherein the antenna forming step includes the step of fabricating the loop antenna from a thin wire positioned on the first substrate material.

10. The method of claim 8 wherein the antenna forming step includes the step of fabricating the loop antenna by printing a conductive ink onto the first substrate material.

11. The method of claim 8 wherein the first substrate material is paper and the second substrate material is paper.

12. The method of claim 8 wherein the first substrate material is plastic and the second substrate material is paper.

13. The method of claim 8 wherein the first substrate material is plastic and the second substrate material is plastic.

14. The method of claim 8 further including the step of embedding a power cell in said tag for providing operating power for said integrated circuit.