Transferred flexible integrated circuit
First Claim
Patent Images
1. A method of fabricating a flexible circuit device comprising:
- providing a silicon-on-insulator structure including a silicon device layer or an insulating layer that extends over a semiconductor substrate;
fabricating an integrated circuit with the device layer; and
transferring the integrated circuit from the semiconductor substrate to a flexible material, the integrated circuit having a plurality of spaced interconnected semiconductor regions that form a flexible integrated circuit.
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Accused Products
Abstract
Integrated circuits for use in electronic devices requiring high density packaging are fabricated to provide highly flexible and ultra-thin devices having a variety of applications. The flexible circuits have dimensions up to several centimeters in surface area and thicknesses of a few microns. These circuits are fabricated using transfer techniques which include the removal of VLSI circuits from silicon wafers and mounting of the circuits on application specific substrates.
607 Citations
40 Claims
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1. A method of fabricating a flexible circuit device comprising:
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providing a silicon-on-insulator structure including a silicon device layer or an insulating layer that extends over a semiconductor substrate; fabricating an integrated circuit with the device layer; and transferring the integrated circuit from the semiconductor substrate to a flexible material, the integrated circuit having a plurality of spaced interconnected semiconductor regions that form a flexible integrated circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of fabricating a thin flexible circuit device comprising:
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providing a first substrate having a semiconductor material on an insulating layer that extends over the first substrate; fabricating an integrated circuit with the semiconductor material; providing a second substrate having an adhesive layer that is separated from the first substrate with a separation layer; transferring the integrated circuit and insulating layer from the first substrate to the second substrate such that the integrated circuit adheres to the adhesive layer; removing portions of the adhesive layer to expose the integrated circuit therein; and removing the second substrate at the separation layer to provide a flexible integrated circuit. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of fabricating a thin film flexible circuit device comprising:
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providing a semiconductor substrate; fabricating an integrated circuit with the semiconductor substrate; providing a second substrate having an adhesive layer separated by a separation layer; transferring the integrated circuit from the substrate to the second substrate such that a first surface of the integrated circuit adheres to the adhesive layer; forming an intermediate structure that exposes a second surface of the integrated circuit; providing a third substrate having a second adhesive layer; transferring the intermediary structure to the third substrate such that the semiconductor material adheres to the second adhesive layer; and removing the second substrate to expose the first side of the integrated circuit; and sealing the integrated circuit to form a flexible integrated circuit structure. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A smart card flexible circuit device comprising:
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a silicon semiconductor material on a silicon dioxide layer; an integrated circuit fabricated with the silicon semiconductor material; an encapsulating layer to seal the integrated circuit; and a flexible support layer adhered to the integrated circuit. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A flexible circuit comprising:
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a flexible layer of semiconductor material having a first integrated circuit formed with the first layer of semiconductor material; a second layer of semiconductor material having a second integrated circuit formed with the second layer of semiconductor material; a separation layer between the first integrated circuit and the second integrated circuit, the first integrated circuit being electrically connected to the second integrated circuit, an encapsulating layer to seal the flexible circuit; and a flexible support layer adhered to the flexible circuit. - View Dependent Claims (37, 38, 39, 40)
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Specification